Tooling Engineer
CurrentProjects which being as major tooling engineer include be not limit to:2014 Sony Z3 compact; Tokyo Unit, Japan;Project key point: transparent belt with both side painting+NCVM; with CNC holes;Tooling key point: transparent part double-shot molding;2014 Project key point: 3-shot part after painting with CNC holes;Tooling key point: the 1st 3-shot tooling develop;2013 Sony Z1 T-Mobile version and TD-LTE version; Beijing Unit, China;Project key point: belt with NCVM+Laser+painting;Tooling key point: PA+55%GF part with painting;2012 Sony C530X Global version and TD-LTE version; Beijing Unit, China; Project key point: transparent belt with CNC;Tooling key point: transparent belt double-shot molding; sheet metal inset molding2011 Sony Xperia P Lt22i; Lund unit, Sweden;Project key point: transparent belt with CNC;Tooling key point: transparent part double-shot molding( transparent part as the 1st shot; 2011 Sony Xperia U St25i; Beijing Unit, China;Project key point: transparent belt with CNC;Tooling key point: transparent belt double-shot molding; sheet metal inset molding2010 Sony Xperia S Lt26i; Tokyo Unit, Japan;Project key point: transparent belt with CNC;Tooling key point: transparent belt double-shot molding; The 1st Index tool develop;sheet metal inset molding;2010 Sony-Ericsson X8; smart phone Lund unit, Sweden;Project : Lamination window with front cover;Tooling : sheet metal inset molding;2008 Sony-Ericsson T715 slider phone; Chennai unit, India;Project : slider phone develop, oversea working;Tooling : sheet metal inset molding;2007 Sony-Ericsson-W380i-Flip phone;Lund unit, Sweden;Project : Filp phone develop, oversea working;Tooling : The 1st sheet metal inset tooling& molding;1st stamping tool;2006 Simens -EF81-Flip Metal phone;The 1st Filp metal phone, oversea support;The 1st PA+GF resin molding+painting;