Samuel Ruiz Email and Phone Number

As a Research Assistant in the E3C consortium at UTEP, I am developing a Deep Level Transient Spectroscopy (DLTS) setup to characterize defects in semiconductor materials, with a current focus on testing silicon diodes. This setup will ultimately be used to assess how materials and devices respond to extreme environmental stressors, such as high temperatures and radiation exposure. My work is crucial for improving the reliability and performance of electronics in high-power energy systems, space applications, and national defense technologies. By contributing to this foundational research, I am helping to advance the DOE/NNSA’s mission to develop a skilled workforce capable of addressing the challenges faced in extreme environments.

During my internship at Freeport McMoRan’s Bagdad Operations, I worked as an electrical engineer in the engineering services department, primarily serving as a project engineer. I led three key projects: installing electrical equipment for a gland water seal system at the copper cleaners, installing a chiller for SX/EW rectifiers, and conducting a load study for a LAN room expansion ahead of a new mining project.In these roles, I contributed to significant cost-saving measures. The new seal system reduced the need for constant maintenance, while the chiller installation prevented overheating of the rectifiers, saving thousands of dollars in annual repairs. For the LAN room expansion, my analysis ensured sufficient capacity to support future operations without costly delays. Additionally, I supported an arc flash study by gathering critical data and gained valuable hands-on experience by shadowing electricians, operators, and managers across various departments.The internship culminated in my selection to present my work at Freeport’s corporate headquarters in Phoenix, AZ, from a competitive national pool of interns.

At UTEP's W.M. Keck Center for 3D Innovation, in collaboration with the Aerospace Corporation, I worked on enhancing a cutting-edge hybrid multi-3D system focused on aerospace applications. My role involved leveraging additive manufacturing (AM) technology to print polycarbonate substrates with embedded custom circuits, a critical step toward on-orbit manufacturing. This approach aims to reduce the need for launching excess spare electronic parts, a current challenge in space missions.As part of this project, I helped analyze various RC circuits, sensors, and MOSFET circuits to ensure proper solder dispensing and reflow. We assessed whether the high heat profiles of our AM system introduced any degradation in these circuits. This research not only advanced our understanding of embedding electronics via AM but also contributed to a soon-to-be-published paper. I had the opportunity to present our findings at local conferences, further highlighting the potential of this technology for space applications.

At NASA's White Sands Complex, I assisted the RF engineering staff with system performance measurements, troubleshooting, and engineering modifications for various antenna and RF systems. My role involved troubleshooting, maintaining, and updating legacy ground station antennas and RF processing systems to prevent component degradation and ensure equipment longevity. I conducted testing and data acquisition using a portable Standard Gain Antenna Test Set (SGATS) to measure the gain-to-temperature ratio of new ground station antennas, including those for critical missions like Artemis.I also collaborated with a team to develop an updated version of the SGATS system, expanding its capabilities across multiple frequency bands. We met project deadlines, regularly reported to NASA leadership, and adhered to workspace guidelines. Beyond technical work, I engaged in biweekly meetings with interns nationwide, attending workshops on AI, robotics, and career development, culminating in a final report to NASA leadership.

During the NSF REU Sensors! summer program at the University of Maine, I conducted research on passive circuit components for high-temperature applications using thick film technology, focusing on resistors. Within a strict two-month timeframe, I conceptualized, designed, screen-printed, and tested resistors with various ohmic values, resulting in components capable of withstanding temperatures exceeding 450°C. This work was critical for advancing durable electronics in extreme environments.I presented my findings and testing methods at an end-of-program conference to an audience of mentors, peers, and National Science Foundation representatives.

Supervised and coordinated volunteers and large groups of people during organization events and field trips while collaborating with different field professionals, maintaining order, and ensuring everyone was engaged and on schedule. Participated in professional development workshops, networking events, and an end-of-program conference that presented the outcomes of my internship to my employer and colleagues.