- Completed a new run of fundraising on 2021- keep growing from 20 to 31 teammates - accumulating shipment reaching 450kk VCSEL chips till Q3/2022

- to lead whole R&D team to cover epitaxy design, device design and package design- delivered VCSEL chip product line for proximity sensor used for mobile phone or TWS- develop patented wafer-fusion type VCSEL Flip-Chip and keep completing the patent portfolio- also take the response as technical marketing role to develop the business and engage the customer

● Kickoff product-line for LED projector in Epistar from zero, cowork with WW 1st tier Projector Maker. The revenue from zero up to US 1M per year● As the Marketing and Sales director to lead a team for LED CSP business development. Majorly focus on TV BLU and Flash for mobile. Using three years, revenue from zero up to USD 33M at 2017.● According to the potential blooming for laser new applications, kick-off VCSEL development project in Epistar, and form a team to handle business development from zero.● Completed the business engagement and as the project coordinator with 1-tier US customer for ULTRA-TINY LED development on display related application

*To lead the R&D division for LCD backlight business, including LED component developing and LightBar developing*Develop the new material venders, i.e. PCB/MCPCB, connector, en-cap and others*Support the sales team in the first line to face the customer for technical question/requirement/problem-solving

- Created and led the LED BLU team on mech., modullization, optical and electrical designs- WW 1st entire-PCB base LED backlight & several special optical design for backlight- Created and led projection team on mech., optical, LED module and electrical designs, then also merge ''Touch Panel'' team in 2009- WW smallest pico-projection module, only 6cc (typ. ~15cc)‏- Won the “Best Innovation Product Award” from 2nd CN SSL Innovation Contest- Engaged over 3M HKD collaboration and support other several cases Created and maintain the supply-chain from up-stream to down-stream for creating larger impact of ASTRI

Lead a special issue group for Micro SD card (Trans Flash) to achieve two more flash chips stacking technology with PTI Corp. (The biggest one professional DRAM component/module assembly and testing OEM company in Taiwan).Co-planning a project with MXIC Ltd. Co. about CiSP and through-hole type 3D stacking package development.As the project leader of a task under “3D ICs Project.” This task is funded by 5 million NT dollars to study on “high precious batch self-alignment bonding technology”. It will be focused on RF and image sensing application.Created two government funded industrial projects about “Image Sensor Module”.Completed the first IP Mapping of embedded active technology, and it included searching strategy establishment, technique classification, management figures.DDRII-like CiSP passed lead-free required Level-3 precondition test, TCT and PCT ongoing now, created ultra-thin (~50um) chip bonding process for CiSP project, and planned the project direction in 2004 and 2005Led a special team for “CMOS Image Sensor Package/Module” to analyze related patent prior arts and to create new ideas. In this effort, we generated several patents for image sensor CSPs, active lighting systems on lens holder, and low-cost image sensor packages.Demonstrated Taiwan’s first capability for 50um wafer thinning technique which integrated efforts from MIRL and ERSO in ITRI. Now, we can achieve 4”, 6”, and 8” SiO2/Si3N4 or PI on Si wafers of 30um thick. The backside treatment to enhance chip strength, dicing before grinding, and laser cutting techniques were also developed.Integrated and developed the thru-Si (TSV) type 3D stacking technology in ERSO/ITRI which included several core technologies, such as wafer thinning, holing, filling, and special assembly process.Joined Flip-Chip assembly team and focused on dispensing and cleaning processes. In the research, we successfully demonstrated the assembly technologies on 4000I/O Flip-Chip packages