Research And Development Intern
Current- Optimized electrochemical conditions and chemical concentrations for SnAg based wafer-level packaging, enhancing the performance and reproducibility of the product - Conducted comprehensive analysis using several techniques including SEM, FIB, Scanning Microscope 3D Profiler, AA, and HPLC ensuring high-quality results and precision in experimental outcomes- Presented findings in weekly group meetings, culminating in a final presentation to colleagues and executives of multiple business units