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Sungwon Han Email & Phone Number

Member of Technical Staff, Package Reliability at Micron Technology
Location: United States 6 work roles 1 school
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Current company
Role
Member of Technical Staff, Package Reliability
Location
United States

Who is Sungwon Han? Overview

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Quick answer

Sungwon Han is listed as Member of Technical Staff, Package Reliability at Micron Technology, based in United States. AeroLeads shows a matched LinkedIn profile for Sungwon Han.

Sungwon Han previously worked as Principal PKG Reliability Engineer at Micron Technology and Senior Reliability Engineer at Samsung Electronics. Sungwon Han holds Doctor Of Philosophy (Ph.D.), Mechanical Engineering from University Of Maryland.

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Email format at Micron Technology

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Micron Technology

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Profile bio

About Sungwon Han

Experienced Senior Reliability Engineer with a demonstrated history of working in the semiconductors industry. Skilled in Electronics Packaging, Materials Science, Mechanical & Reliability Engineering, and FEA. Strong quality assurance professional with a Doctor of Philosophy (Ph.D.) focused in Mechanical Engineering from University of Maryland College Park.

Listed skills include Failure Analysis, Root Cause Analysis, Reliability Engineering, Reliability, and 25 others.

Current workplace

Sungwon Han's current company

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Micron Technology
Micron Technology
Member of Technical Staff, Package Reliability
Website
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6 roles

Sungwon Han work experience

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Role listed

Micron Technology

Senior Reliability Engineer

Suwon-Si, Gyeonggi-Do, Kr

- Establishing the Qualification Specification of Semiconductors for Automotive Applications- Optimization of Quality Process and Spec. for Memory Module and SSD (Solid State Drive)- Establishing the Qualification Specification of Board Level Reliability Test for Electronic Packages- Assessment of Corrosion Failure Risk of Memory Module- Development of Moisture Diffusion Simulation for Electronic Packages

Nov 2012 - Jul 2018

Research Assistant

College Park, Md, Us

Center for Advanced Life Cycle Engineering (CALCE):- Risk Analysis and Characterization of Failure caused by Tin Whisker Growth- Reliability Test and Failure Analysis of Electronics Products (IC packages and PCB assembly)- Root Cause Analysis based on Physics of Failure- Mechanical and Electrical Characterization of IC packages (Lead-free solders, QFP, Flip chip and μBGA)

Jan 2008 - Nov 2012

Graduate Research Assistant

Chungang University

- Characterization of Mechanical Reliability of Fine-pitch Flip Chip Packaging- Reliability Characterization of Lead-free Solder Pastes- Standardization of Mechanical Test methods for Lead-free Solder Paste

Mar 2004 - Dec 2008
Team & coworkers

Colleagues at Micron Technology

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1 education record

Sungwon Han education

  • University Of Maryland
    University Of Maryland
    Mechanical Engineering
FAQ

Frequently asked questions about Sungwon Han

Quick answers generated from the profile data available on this page.

What company does Sungwon Han work for?

Sungwon Han works for Micron Technology.

What is Sungwon Han's role at Micron Technology?

Sungwon Han is listed as Member of Technical Staff, Package Reliability at Micron Technology.

Where is Sungwon Han based?

Sungwon Han is based in United States while working with Micron Technology.

What companies has Sungwon Han worked for?

Sungwon Han has worked for Micron Technology, Samsung Electronics, University Of Maryland, and Chungang University.

Who are Sungwon Han's colleagues at Micron Technology?

Sungwon Han's colleagues at Micron Technology include Misha Furmanov, Anjaly M A, Taylor Aikenhead, Bryan Atanga, and Gary Cope.

How can I contact Sungwon Han?

You can use AeroLeads to view verified contact signals for Sungwon Han at Micron Technology, including work email, phone, and LinkedIn data when available.

What schools did Sungwon Han attend?

Sungwon Han holds Doctor Of Philosophy (Ph.D.), Mechanical Engineering from University Of Maryland.

What skills is Sungwon Han known for?

Sungwon Han is listed with skills including Failure Analysis, Root Cause Analysis, Reliability Engineering, Reliability, Testing, Labview, Pcb Design, and Semiconductor Packaging.

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