Senior Failure Analysis Engineer
CurrentI am tasked with the challenge to find the root cause of failure of integrated circuit devices.• Electrical testing and characterization of the devices by using digital multimeters, programmable power supplies, curve tracers, oscilloscopes, semiconductor parameter analyzer (SPA)• Physical inspection through optical microscopes, laser microscopes, X-ray, Scanning Acoustic Microscopy (C-SAM), and Scanning Electron Microscopy (SEM) • Physical deprocessing of IC devices through use of P-lapper, Ion cross-milling, REI etchers, and chemical etches• Using nano-probing tools and techniques to electrically analysis circuits during and after delayering the sample• Using CAD based software to analyses the circuitry for localization and physical FA• Knowledgeable on semiconductor physics• Work with state-of-the-art technology ranging from +100nm down to 7nm nodes• Major Tools used:o SEM: 4800 & 4700 serieso Dage: X-rayo InferRed Emission Microscope (IREM)o QFI Thermalo Thermo fisher Scientific Nano-prober III (tool owner and “super” user) Atomic Force Prober (tool owner and “super” user) Meridian and Emii• FA Techniques:o Defect localization PEM Thermal hot spot Dynamic laser stimulation Static laser stimulation / OBIRCHo Delayering Physical P-lapping Wet/Dry chemical Ion milling cross-sectionso Electrical analysis (during/post delayering) DC IV sweeps using nanoprobing / microprobes Nanoprober: Electron Beam Induced Current Change (EBIRCH) / Electron Beam Absorption Contrast (EBAC) SEM: Passive voltage contrast