Thinh Le Email and Phone Number
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Thinh Le is a Technology Development Engineer at Intel Corporation at Intel Corporation. He possess expertise in materials science, thin films, chemical engineering, semiconductors, organic chemistry and 10 more skills.
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Technology Development EngineerIntel Corporation Aug 2016 - PresentHillsboro, Oregon -
Graduate Research AssistantPenn State University Aug 2011 - Jun 2016University Park, PaMorphology and interfacial structure of fully conjugated block copolymers for organic photovoltaics:• Designed and synthesized conjugated block copolymer semiconductors for structure and interface control in the active layer of organic photovoltaics.• Characterized the dynamic morphology evolution of block copolymer thin films under a variety of casting and annealing conditions, using in-situ wide and small angle X-ray scattering.• Studied the structure-performance relationship in block copolymer photovoltaic devices; and identified the crystallization suppression of donor block as the main driving force for the formation of the lamellar structure in block copolymer films.• Discovered an ordered phase in acceptor block at elevated temperatures that is responsible for improved charge mobility and better overall block copolymer device performance.Contact doping at organic semiconductor and metal interface with polyelectrolytes for organic photovoltaic applications:• Developed different classes of polyelectrolytes for interfacial doping of organic semiconductor-metal interface through collaboration with Prof. Michael Hickner from Materials Science at Penn State.• Developed low-temperature processing method to optimize performance of photovoltaic devices doped with different classes of polyelectrolytes.• Characterized surface potential of doped interfaces using Kevin probe force microscopy.• Investigated the complex relationships between doping effectiveness, acid strength of polyelectrolytes, and phase segregationi between polyelectrolytes and organic semiconductors (near the interface); and proposed general guidelines for efficient interfacial doping with polymeric dopants. -
Scale Up Engineer (Co-Op)Dupont Sep 2008 - Mar 2009Philadelphia, Pa• Optimized media milling protocol by investigating the effect of media types and sizes on dispersion processes for polyvinyl fluoride (Tedlar).• Leveraged Primer’s dispersion technology to Tedlar family to achieve robust, reproducible process and optimized productivity while lowering processing temperatures.• Developed new Tedlar one-step milling process to cut down production time by 50%. -
Student Researcher (Co-Op)Saint-Gobain Sep 2007 - Mar 2008Philadelphia, Pa• Applied fluidized bed coating technology to fabricate copper coated granules for anti-mildew roofing applications. • Investigated leaching process of copper coated granules.
Thinh Le Skills
Thinh Le Education Details
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Chemical Engineering -
Magna Cum Laude
Frequently Asked Questions about Thinh Le
What company does Thinh Le work for?
Thinh Le works for Intel Corporation
What is Thinh Le's role at the current company?
Thinh Le's current role is Technology Development Engineer at Intel Corporation.
What is Thinh Le's email address?
Thinh Le's email address is th****@****ail.com
What schools did Thinh Le attend?
Thinh Le attended Penn State University, Drexel University.
What skills is Thinh Le known for?
Thinh Le has skills like Materials Science, Thin Films, Chemical Engineering, Semiconductors, Organic Chemistry, Microscopy, Characterization, Nanotechnology, Matlab, Research, Research And Development, Coatings.
Who are Thinh Le's colleagues?
Thinh Le's colleagues are Hao Wu, Supreetha Nj, Todd Jennings Davis, Muhd Saiful, Barry Hines, Yen Shue, Nishi Ahuja.
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