Tim Lin Email & Phone Number

The following are my practical experience:•Managed a FA team’s scheduling and progress, also responsible of the new employee orientation.Analyzed the specimen (including 2D/2.xD/3D ICs, wafers, PCBs, etc.) which were invalid for unknown reason, and found the root cause.•Supported the department of Integration or Process Engineer for NPI’s(New Product Introduction) analyzing or suggesting applicable DOE arrangement.•Familiar with: 1. Non-destructive analysis instruments(including SAM, 2D/3D X-ray, Shadow Moiré, etc.) 2. Physical analysis instruments(including FIB, SEM, AFM, etc.) 3. Sample preparation skills(parallel lapping, cross-section, etc.) 4. Fault isolated by Lock-In IR Thermography, I-V curve, or other electrical failure analysis results.

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  東海大學

  學士