Todd Schmidt Email & Phone Number

Hillsoboro Oregon

Hillsboro Oregon

Seasoned semiconductor professional with 28 years of experience in semiconductor manufacturing and technology development. Proven leader with over 20 years in management roles, adept at defining, forming, and leading high-performing teams and organizations. Expertise in transitioning technologies from development to high-volume manufacturing (HVM), driving factory operations and cost reduction, and engaging with key semiconductor suppliers. Skilled in process control, tool matching, and fault detection across diverse factory settings.

Designed, formed, and orchestrated the formation of the manufacturing organization within TD, managing over 280 engineers, 400 technicians, and 50 managers. The result was a TD manufacturing organization that delivers the required manufacturing development and expertise concurrently with the process development. Factory is over 1 million square feet of clean room space.Directed the operation, maintenance, troubleshooting and matching of over 250 main tools in production or technology development.Responsible for factory cycle time, availability, cost reduction, productivity, product quality, maintenance, repair, capacity planning, and tool matching.Promoted and trained new managers, with over 90% being new to management roles.Successfully ramped Intel 4 and transferred it to Intel Ireland with flawless technical startup at the HVM site.Close partnership with TD organization to deliver continued advances in semiconductor scaling and performance.Installed, qualified, and currently ramping the Intel 18 production line, with a defined and executed capacity roadmap.

Formed and managed a shift manufacturing organization with over 400 technicians, 50 compressed workweek engineers, and 25 shift managers. The result was a consolidated and unified approach to fab operations, maintenance and repair.Directed all tactical fab operations, including wafer movement, recovery, and maintenance for four suppliers across nine major toolsets.Ensured the organization consistently delivered superior results by effective partnerships with process engineering and manufacturing.Delivered breakthrough solutions for the 10nm constraint module, enhancing factory ramp-up and operational efficiency.Promoted and trained 25 managers from technician roles to first-line management.Established standardized technician training packages and certifications, including over 400 standard and 100 advanced maintenance certifications.Navigated and resolved pandemic-related challenges for on-site personnel.

Managed engineering for TEL, AMAT, and LAM tools across Intel’s 14nm process line with a team of 6 managers and 50 engineers.Led cost management for 14nm factory operations and owned technology development for Intel 16 and 14nm lines.Acted as the central contact for Intel 16 technology development.

Led engineering groups for dielectrics, polish, and etch within LTD, driving technology development and high-volume manufacturing work.Chair for defect reduction in POLY and contact patterning, and managed Intel’s 14nm etch installation and qualification.

Managed dielectrics and polish groups, leading the transfer, startup, matching, ramp, and sustaining of Intel’s 90 and 65nm lines.Successfully managed the first 300mm overseas and greenfield startup in a different country and organizational culture.

Held various roles including Dielectrics Process Engineer, Tungsten and CVD Tungsten Adhesion Engineer, and CMP Process Engineer.

Managed thermal oxidizer up-time and Cal-EPA compliance.Project manager for the installation and startup of a novel low NOx heat transfer fluid furnace.