As a Product Development Engineer specializing in Failure Analysis at AMD, I focus on ensuring product reliability and enhancing yield performance through advanced diagnostic techniques. With expertise in both destructive and non-destructive methodologies, I uncover critical insights into die-level defects, contributing to yield improvement, customer return analysis, and successful new product introductions.My hands-on experience includes destructive inspection techniques like decapsulation, deprocessing, delayering, CMP, RIE, and FIB to precisely identify hidden defects within semiconductor chips. Additionally, I leverage non-destructive tools such as SEM, optical microscopy, and circuit tracing to classify and address a wide range of issues.Passionate about continuous improvement and innovation, I strive to solve complex challenges in the semiconductor industry, driving product excellence and reliability at AMD. I am always open to connecting with like-minded professionals, industry experts, and anyone interested in technology, materials science, or innovative solutions. Let's connect and explore the possibilities of collaboration and mutual growth!