Wayne Mu Email and Phone Number

Power module development for EV• Project management, planning, risk analysis and mitigation• Technical communication with customer and material suppliers.• DSC and single side power module development• Power module sintering on the heatsink of inverter for EV.• Tooling concept design for sintering, soldering and molding.• Process investigation and optimization such as sintering and transfer molding.• DOE and Failure analysis.• Coordination of software and mechanical division for equipment modification.

Optical sensor development and system integrationMainly working for optical fingerprint sensor development and system integration• Optics element process development such as micro-lens and filter and aperture.• Process integration of optics and packaging with TSV and WB. • System coordination with optic design, algorithm and hard-ware team.• Failure analysis after reliability test and improvement.

FPS product developmentMainly responsible for the packaging design and process development of capacitive fingerprint sensor (FPS) for smartphone • Development of TSV-based SIP for capacitive FPS component (HVM).• Design and development Ultra-thin Shell-case TSV WLCSP packaging for capacitive FPS component (HVM). • Design and development of Wafer level FANOUT for capacitive FPS component. • Failure analysis of component or module after reliability test. • Documentation of the HVM product and component design rule guidance for the local team in China. Additionally, Stand-in of project leader for the planning and follow-up, as well as the coordinates and communication with test team, hardware integration team and operation team internally, or with the suppliers(OSATs), module house and OEMs externally.

3D integration of carbon based electronics.My research focused on the use of carbon based nano-materials (CNT and graphene) in the electronic device fabrication and microelectronics packaging. Main activities cover the synthesis CNT and graphene by CVD, CNT bundles filled TSV interconnects, SWCNT and graphene transistor fabrication and 3D integration of carbon based electronic.• Packaging technology concept design and development.• Design and process development for 3D integration of carbon based electronics • Process development of tape-assisted CNT bundles transfer for through-silicon-via (TSV) interconnects• Technology development of Cu electroplating on CNT (nanocomposite) for TSV interconnects• Development and demonstration of CNT filled TSV for 3D packaging • Material characterization, and thermal/mechanical/electrical reliability test and failure analysis• Chemical vapor deposition synthesis of carbon nanotube and graphene

• Process development of metal matrix polymer fiber composite• Thermal interface material (TIM) application

Proposal writing for Natural Science Foundation of China (NSFC)

Dynamic simulation of copper stud bump shaping and FEM thermal/mechanical/current reliability simulation of copper stud bump solder joint in flip chip on board (FCOB) packaging.• 3D copper stud bump model development based on the explicit finite element method, • Design of experiment (DOE) to investigate the influence of bonding process on the stress, strain and temperature• 3D finite element model establishment to analyze the stress and strain distribution during thermal cycling • Thermal fatigue life predication of solder joint was by Darveaux method • Electric-thermal couple daisy chain finite element models establishment to study and compare the influence of the traditional solder joint and copper stud bump solder joint, the SMD land pad and NSMD land pad on the max electric density in the electric crowd zone.