Thermal And Mechanical Engineer
Taiwan
• Evaluate 800G/1.6T transceiver deployment for hyper-scale (AWS/NV) early on the architect, and collaborate with data center switch brands(Cisco/Arista)/ODMs throughout the development cycle from POC to MP. • Complete the 1U Switch 1KW I/O demo design within a month and fabrication on time for the OCP show project. • Seamlessly work with North America PM/FAE to maximize business success, linking two BU's design center resources as new branding, and presenting annual roadshows to APAC customers as an MSA influencer. • Utilize Flotherm/Icepack to ensure 90% accuracy&confidence in performance prediction during passive/air/liquid cooling validations. Develop innovative tools in model simplification for high altitude and NIC cards. • Lead 112/224G platform OSFP/XD and QSFP/DD for Cage/AEC/AOC road map, resulting in a 20% improvement. • Review test plan&result to solve thermal failure issues from the prototype laboratory to the production line, reducing the issue solve time by 60% by database creation and using Jira track to align scrum and kanban principles. • Establish a training document/SOP library, enabling new supervisors and senior engineers to onboard quickly. • Receive annual spot award representing Taiwan design center and continuously receive annual increases.