Content owner for vaiour FEOL/MOL BEOL test-sites for various technologies: 22nm, 14nm, 7nm.---Define defectivity contents to monitor and improve baseline yields.---Define various macros to monitor parametric and systematic contents:---Create test macros for new failmodes.---Simplify macros for easy design, testing or analysis.---Prioritize DOE contents based on failmodes understanding and client needs.

22nm FEOL/MOL characterization support: interface with integration/process/device/metrology team to improve yield and fix systematic yield detractors.22nm overall yield prioritization and roadmap through PDF patented designs.product bin-sort and data analysis and correlation to yield/parametric/device/metrology to find possible yield detractors.test macro DOE, implementation and analysis to monitor key yield detractors with enough observability.

Research and Development: CV DOE and design research.Research and development: scribeCV application and analysis methodology.Research and development: CMOS device variation characterization and breakdown. Silicon to spice calibration methodology development.Testing: Manual and automatic probe testing.Application: Yield Ramp Simulator application and development. Custom scripts to enable a variety of layout attributes extraction. Application and Research/development: SRAM… Show more Research and Development: CV DOE and design research.Research and development: scribeCV application and analysis methodology.Research and development: CMOS device variation characterization and breakdown. Silicon to spice calibration methodology development.Testing: Manual and automatic probe testing.Application: Yield Ramp Simulator application and development. Custom scripts to enable a variety of layout attributes extraction. Application and Research/development: SRAM extractions and micro-events breakdown by layer/bits. Compact SRAM repair models.Application: Fail-rate modelling. Show less

e-beam lithography using nano-emittersnano device fabrication in clean roomnano materials characterization using SEM/TEM/AFM,etcnano device packaging and characterization using wire-bonder, e-test, photo-absorption,etc.