Xiaojun Wang Email & Phone Number

San Jose Ca

o Manufacturing Management on 3-8” wafers for Compound Semiconductor, Passive PLC and LCoS optical products for WSS in ROADM, FMCW LiDAR, Transport, Datacom, Telecom and Transmission applications: Engineering Process, Product Engineering, Testing team, Production team, Equipment, Facility, Reliability and Quality engineering teams towards on schedule delivery by the planning;o Engineering Management on Compound Semiconductor, PLC and LCoS production processes with MEMs/CMOS Process and Assembly steps including: Thin Film (PECVD, APCVD and PVDs, etc), Dry and Wet etch, Photo-Lithography, Dicing and Polishing on wafer/strip/bar levels, Facet Cleaning, AR Coating on WG facets, Pyrex and Si Cap assembly, Temperature Cycle Burning, Testing, Singulation, Testing and Visual Inspection on the output products;o Leading NPI Development and Managing NPI Programs with design team, process team and testing team for Photonic Devices on different substrates/materials: GaAs/InP, Silica on Silicon, Grating thin films; o Leading and Supervising engineering process team to drive the process development, the yield improvement, capacity assessment, performance and reliability, on-time delivery schedule for the Lean Manufacturing, Quality control, Cycle time management and Cost reduction on the products;o Designed, Developed and Qualified 8” semiconductor wafer fabrication processes and LCoS assembly processes; Integrated various processes and developed wafer fabrication and LCoS assembly process flows for different NPIs in the fab;o Sustained various wafer fab and LCoS processes with emphasis on SPC, Cpk, Control Plan, Failure Analysis, 8D report, DFMEA, PFMEA, Gauge R&R, etc; Conducted process capability analysis, cycle time, yield improvement and cost reduction by the continuous design and process improvement;

Development and Integration of the metal and dielectric films within the advanced magnetic recording heads: a) R&D for nanoscale Spin Torque Oscillators within the limited gaps to achieve the microwave assistance and Ultra-low-RA TMRs with better performance for magnetic readers in HDDs;b) Development for the dielectric films for the passivation, insulation, encapsulation, optical waveguides, capacitors with CVD, MOCVD, PECVD, ALD and PVDs;c) Process Control of the thin film fabrication on 6” wafers with SPC control, data analysis, failure analysis, DOEs, equipment capability, etc;d) Development for the sputtering etching conditions of different surfaces on 6” wafer processing for the pre-film depositions and post-film depositions;

San Francisco Bay Area

o R&D for Magnetic Sensors based on TMR Technology: including Mature and Potential applications for Industrial and Consumer markets. The products include; magnetic switches(Omnipolar & Bipolar), current sensors, linear sensors, currency detection heads, rotary sensors, gradiometers and 2/3 Axis magnetic compasses;o Working with module process development and manufacture engineering teams to set up and develop processes to satisfy design requirements in the foundries;o Developing and Driving the Improvement of the integration process for products within the foundries: DOEs, SPC Parameters, Failure Analysis, FEM Analysis, Reliability Control, Root Cause Analysis, Problem-Solving, Data collection and Analysis;o Site Management for Manufacturing of Magnetic Sensors on 6” wafers; o R&D for other Micro-Sensors based on AMR/GMR and MEMS Techonologies: temperature sensors, pressure sensors, gyroscope sensors and magnetic bioassays with microfluidics.

R&D on the advanced read head sensors for the areal density more than 1TB/in2 in hard drive disks: Shrinking the dimension of the sensors into the sun-100nm range for the detectable signals.a) Fabricated the spin accumulation sensors under 100nm range with the novel method within the Yerba Buena Research Center; b) Detected the signals of the sensors by the variations of widths and the gaps between the current sources and the signal detector's;c) Achieved and Detected the doubled signals from the newly-designed/made structures with 3-terminals;

Ph.D; Department, Physics; Physics; Astronomy

Master Of Science, Physics