Xiaoping Zhang

Xiaoping Zhang Email and Phone Number

Vice General Manager @ Shanghai, China
Shanghai, China
Xiaoping Zhang's Location
Shanghai, China, China
About Xiaoping Zhang

Over 18 years experience in semiconductor, LED and Discrete devices industries in 5 MNCs.Current Location: ShanghaiMP: +86 15640876816.

Xiaoping Zhang's Current Company Details
Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co.

Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co.

Vice General Manager
Shanghai, China
Xiaoping Zhang Work Experience Details
  • Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co.
    Vice General Manager
    Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co.
    Shanghai, China
  • Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co. Ltd
    Vice General Manager
    Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co. Ltd Jun 2018 - Present
    Hanzhou & Xiamen
  • Littelfuse
    Senior Manager Of Process Development, Npd And Lab
    Littelfuse May 2016 - May 2018
    Wuxi
    Senior manager of New Process Development and Integration, New Product Development, LAB
  • 广东德豪润达电气股份有限公司
    Operation Director
    广东德豪润达电气股份有限公司 Apr 2013 - Apr 2016
    Dalian, Liaoning, China
    Job Title: 2014.7~:Operation Director of Flip Chip wafer Fab2013.4~2014.7: Engineering Department Manager, Senior RD process ManagerReporting to: VP of Chip Business UnitSubordinates: ~200 (Manufacturing, Engineering, NPI, PIE…)Responsibility: -Develop and deploy site specific strategies to support the corporate and business unit strategies, manage budgetary responsibility for the whole Operations, Understand and manage monthly financials for the sites -Defining operation strategies and implementing solutions as well as executing on Flip Chip product builds. -Ramp up for Wafer fab and packaging fab Develop process & equipment capability and enabling process technology to support the product roadmap  -Measure and drive improvements to controllable direct, indirect, and service spend and its impact to the bottom line. -Actively hire, manage, and develop the staff members.Major Achievement: -According to BU business strategies, Set up 2015 and 2016 annual budget in flip chip wafer fab. Reviewed and analyzed monthly financial statements of flip chip business for continuous improvement and implemented the plans.  -Led and coordinated different teams (sales, RD, planning, NPI, PIE, engineering, manufacturing) to ramp up the wafer Fab on schedule.(ramp up 3X within 6 months) with production output improvement to ~10M RMB/M.  -Continuously improved system and production line with Lean and Kaizen: improved cycle time 50%, reduced 30% cost in 2015, improved efficiency 20% in 2015. -Continuously enlarged capacity and improved production yield, reduced cost more than 30% per wafer in 2015. -Developed staff members including 3 department managers and more than 10 section managers, set 1:1 every two weeks to give coach timely. -Instructor and Coacher for Project Management in ETI group, Mentor for twice ETI manager training camp in 2014 and 2015.
  • Intel Corporation
    Senior Staff Technologist
    Intel Corporation Oct 2008 - Apr 2013
    Dalian, Liaoning, China
    Responsibility: Transfer and qualify new process from VF to F68 Maintain and improve PVD processes to achieve BIC compared with VF including cost, quality, capacity and Cycle time. Major Achievement ISO9001 Coordinator: Led ISO9001 Certification for Thinfilm/planar Department and F68 PE Co-chair: Worked with Yield Engineer to lead cross-department team to achieve yield and defect BIC. BHAG Innovation Coordinator: Led and coordinated Thinfilm/Planar BHAG Innovation project to achieve cost BIC.  LEAN coordinator: led Thinfilm/Planar department HPM&Lean projects.  Mentor:Coached 4 mentees from 2012 to 2013 to increase the overall capabilities of individuals, Instructor: Nominated as Best Instructor for developed Metallization training material for Intel Globe, awarded as F68 Best Instructor for Project Management, Presentation Skills, Influence Skills, MBPS, ISO…  Strong Slef-motivated Process Engineer: Initiated and promoted a innovation equipment SPC to prevent the excursion from owner’s tool to group, department and whole factory and VF with great passion .
  • Globalfoundries
    Principle Process Engineer
    Globalfoundries Oct 2004 - Oct 2008
    Singapore
    Reporting to: Section Manager of PVDSubordinates: 2Responsibility: Leading and owning process and equipment qualification, tool preventative maintenance, management of troubleshooting activities, regular monitoring of tool/process performance Responsible for the project ownership for improvements in safety, quality, cost, and improved manufacturability performance Process owner and leader for Key process Cu Barrier&Seed process engineer teamMajor Achievement Qualified and released 12 main process tools (1 MOCVD TIN, 9 Cu Barrier&Seed, 1 Al, 1 Ni) Project owner for Cu barrier/seed process development for 90nm, 65nm and 45nm in AMAT Encore II and Novellus INOVA BKM3, BKM4 and BKM5.1, successfully delivered the reliability qualification (SM, EM and TDDB) for new technology from 2005 to 2008. Awarded by Factory for $5M cost saving by improving 30% capacity for Novellus INOVA tools. (the 2nd Innovation Award)
  • Grace Semiconductor Manufacturing Corporation
    Senior Process Engineer
    Grace Semiconductor Manufacturing Corporation Jul 2002 - Oct 2004
    Shanghai City, China
    Responsibility: Leading and owning process and equipment qualification, tool preventative maintenance, management of troubleshooting activities, regular monitoring of tool/process performance Responsible for the project ownership for improvements in safety, quality, costMajor Achievement  Qualified 13 tools (1 PETEOS, 1 PECVD SiN, 1 BPSG, 1 FSG, 6 HDP/STI and 3 metrology tools) Awarded for 2 company’s patent to improve process and equipment quality. Developed new recipes for 0.22/0.18/0.15 HDP/STI process with different D/S ratio, F% and liner recipe.

Xiaoping Zhang Skills

Pvd Thin Films Semiconductors Cvd Design Of Experiments Spc 半导体 试验设计 Failure Analysis Semiconductor Industry Silicon Atomic Layer Deposition Jmp Photolithography Process Integration Ic 半导体行业 Process Simulation Ald Pecvd Led Manufacturing And Operation 制造业 精益生产 项目管理 跨职能团队领导力 管理人员

Xiaoping Zhang Education Details

Frequently Asked Questions about Xiaoping Zhang

What company does Xiaoping Zhang work for?

Xiaoping Zhang works for Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co.

What is Xiaoping Zhang's role at the current company?

Xiaoping Zhang's current role is Vice General Manager.

What schools did Xiaoping Zhang attend?

Xiaoping Zhang attended Tsinghua University, Tsinghua University.

What skills is Xiaoping Zhang known for?

Xiaoping Zhang has skills like Pvd, Thin Films, Semiconductors, Cvd, Design Of Experiments, Spc, 半导体, 试验设计, Failure Analysis, Semiconductor Industry, Silicon, Atomic Layer Deposition.

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