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Xiaoping Zhang Email & Phone Number

Vice General Manager at Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co.
Location: Shanghai, China 7 work roles 2 schools
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Current company
Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co.
Role
Vice General Manager
Location
Shanghai, China

Who is Xiaoping Zhang? Overview

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Xiaoping Zhang is listed as Vice General Manager at Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co., based in Shanghai, China. AeroLeads shows a matched LinkedIn profile for Xiaoping Zhang.

Xiaoping Zhang previously worked as Vice General Manager at Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co. Ltd and Senior Manager of Process Development, NPD and LAB at Littelfuse. Xiaoping Zhang holds Master'S Degree, Materials Science from Tsinghua University.

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About Xiaoping Zhang

Over 18 years experience in semiconductor, LED and Discrete devices industries in 5 MNCs.Current Location: ShanghaiMP: +86 15640876816.

Listed skills include Pvd, Thin Films, Semiconductors, Cvd, and 23 others.

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Xiaoping Zhang's current company

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Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co.
Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co.
Vice General Manager
Shanghai, China
7 roles

Xiaoping Zhang work experience

A career timeline built from the work history available for this profile.

Vice General Manager

Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co.

Shanghai, China

Vice General Manager

Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co. Ltd

Hanzhou & Xiamen

Senior Manager Of Process Development, Npd And Lab

Wuxi

Senior manager of New Process Development and Integration, New Product Development, LAB

May 2016 - May 2018

Operation Director

广东德豪润达电气股份有限公司

Dalian, Liaoning, China

Job Title: 2014.7~:Operation Director of Flip Chip wafer Fab2013.4~2014.7: Engineering Department Manager, Senior RD process ManagerReporting to: VP of Chip Business UnitSubordinates: ~200 (Manufacturing, Engineering, NPI, PIE…)Responsibility: -Develop and deploy site specific strategies to support the corporate and business unit strategies, manage budgetary responsibility for the whole Operations, Understand and manage monthly financials for the sites -Defining operation strategies and implementing solutions as well as executing on Flip Chip product builds. -Ramp up for Wafer fab and packaging fab Develop process & equipment capability and enabling process technology to support the product roadmap  -Measure and drive improvements to controllable direct, indirect, and service spend and its impact to the bottom line. -Actively hire, manage, and develop the staff members.Major Achievement: -According to BU business strategies, Set up 2015 and 2016 annual budget in flip chip wafer fab. Reviewed and analyzed monthly financial statements of flip chip business for continuous improvement and implemented the plans.  -Led and coordinated different teams (sales, RD, planning, NPI, PIE, engineering, manufacturing) to ramp up the wafer Fab on schedule.(ramp up 3X within 6 months) with production output improvement to ~10M RMB/M.  -Continuously improved system and production line with Lean and Kaizen: improved cycle time 50%, reduced 30% cost in 2015, improved efficiency 20% in 2015. -Continuously enlarged capacity and improved production yield, reduced cost more than 30% per wafer in 2015. -Developed staff members including 3 department managers and more than 10 section managers, set 1:1 every two weeks to give coach timely. -Instructor and Coacher for Project Management in ETI group, Mentor for twice ETI manager training camp in 2014 and 2015.

Apr 2013 - Apr 2016

Senior Staff Technologist

Dalian, Liaoning, China

Responsibility: Transfer and qualify new process from VF to F68 Maintain and improve PVD processes to achieve BIC compared with VF including cost, quality, capacity and Cycle time. Major Achievement ISO9001 Coordinator: Led ISO9001 Certification for Thinfilm/planar Department and F68 PE Co-chair: Worked with Yield Engineer to lead cross-department team to achieve yield and defect BIC. BHAG Innovation Coordinator: Led and coordinated Thinfilm/Planar BHAG Innovation project to achieve cost BIC.  LEAN coordinator: led Thinfilm/Planar department HPM&Lean projects.  Mentor:Coached 4 mentees from 2012 to 2013 to increase the overall capabilities of individuals, Instructor: Nominated as Best Instructor for developed Metallization training material for Intel Globe, awarded as F68 Best Instructor for Project Management, Presentation Skills, Influence Skills, MBPS, ISO…  Strong Slef-motivated Process Engineer: Initiated and promoted a innovation equipment SPC to prevent the excursion from owner’s tool to group, department and whole factory and VF with great passion .

Oct 2008 - Apr 2013

Principle Process Engineer

Singapore

Reporting to: Section Manager of PVDSubordinates: 2Responsibility: Leading and owning process and equipment qualification, tool preventative maintenance, management of troubleshooting activities, regular monitoring of tool/process performance Responsible for the project ownership for improvements in safety, quality, cost, and improved manufacturability performance Process owner and leader for Key process Cu Barrier&Seed process engineer teamMajor Achievement Qualified and released 12 main process tools (1 MOCVD TIN, 9 Cu Barrier&Seed, 1 Al, 1 Ni) Project owner for Cu barrier/seed process development for 90nm, 65nm and 45nm in AMAT Encore II and Novellus INOVA BKM3, BKM4 and BKM5.1, successfully delivered the reliability qualification (SM, EM and TDDB) for new technology from 2005 to 2008. Awarded by Factory for $5M cost saving by improving 30% capacity for Novellus INOVA tools. (the 2nd Innovation Award)

Oct 2004 - Oct 2008

Senior Process Engineer

Shanghai City, China

Responsibility: Leading and owning process and equipment qualification, tool preventative maintenance, management of troubleshooting activities, regular monitoring of tool/process performance Responsible for the project ownership for improvements in safety, quality, costMajor Achievement  Qualified 13 tools (1 PETEOS, 1 PECVD SiN, 1 BPSG, 1 FSG, 6 HDP/STI and 3 metrology tools) Awarded for 2 company’s patent to improve process and equipment quality. Developed new recipes for 0.22/0.18/0.15 HDP/STI process with different D/S ratio, F% and liner recipe.

Jul 2002 - Oct 2004
2 education records

Xiaoping Zhang education

FAQ

Frequently asked questions about Xiaoping Zhang

Quick answers generated from the profile data available on this page.

What company does Xiaoping Zhang work for?

Xiaoping Zhang works for Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co..

What is Xiaoping Zhang's role at Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co.?

Xiaoping Zhang is listed as Vice General Manager at Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co..

Where is Xiaoping Zhang based?

Xiaoping Zhang is based in Shanghai, China while working with Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co..

What companies has Xiaoping Zhang worked for?

Xiaoping Zhang has worked for Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co., Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co. Ltd, Littelfuse, 广东德豪润达电气股份有限公司, and Intel Corporation.

How can I contact Xiaoping Zhang?

You can use AeroLeads to view verified contact signals for Xiaoping Zhang at Hangzhou Silan Azure Co., Ltd & Xiamen Silan Advanced Compound Semiconductor Co., including work email, phone, and LinkedIn data when available.

What schools did Xiaoping Zhang attend?

Xiaoping Zhang holds Master'S Degree, Materials Science from Tsinghua University.

What skills is Xiaoping Zhang known for?

Xiaoping Zhang is listed with skills including Pvd, Thin Films, Semiconductors, Cvd, Design Of Experiments, Spc, 半导体, and 试验设计.

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