Ray Chang Email and Phone Number

Hands on WLCSP and CIS-CSP subcon management.  Familiar with new product CIS-CSP and IMG sensor milestone granted mass production.  Familiar with failure analysis and deep dive in root cause finding.  Hands on review PCN including risk assessment, cost impact, qual plan, line stressing plan …etd. and dominate process change in Subcon Hands on raise CRB meeting with Div BEQA, CPA and GKA for PCN kick off and validation report review as well as deployed PCN to… Show more Hands on WLCSP and CIS-CSP subcon management.  Familiar with new product CIS-CSP and IMG sensor milestone granted mass production.  Familiar with failure analysis and deep dive in root cause finding.  Hands on review PCN including risk assessment, cost impact, qual plan, line stressing plan …etd. and dominate process change in Subcon Hands on raise CRB meeting with Div BEQA, CPA and GKA for PCN kick off and validation report review as well as deployed PCN to subcon. NPI Project management o Cooperate with Div and CPA. o Minimize gap between Div, CPA and subcon. HVM device yield improvement. Cross-function cooperate with CPA, Div and ST manufacturing for project milestone movement. New material feasibility evaluation in subcon. Fulfill VIP customer requirement and take a lead for customer visit and support audit with GOBM QA as well as support technical side feedback.Achievement: 7* NPI projects of IMG sensor granted to mass production in 2024, No delay.  Implement new sawing methodology 4-channel cut in subcon reducing stress leading glass chipping during glass saw. Implement new shipping tape for replacing due to burr generation from tape adhesive layer during storage test. Yield improvement 20.5% in Automotive- IMG sensor project for replacing thinner blade size due to evaluate non-suitable blade size (thick) in NPI stage. Evaluate FDC and ADC project in subcon.  Low-cost material evaluation in Subcon. Show less

Senior R&D Engineer, CIS/ 3DIC Back-End of Line Hands on CIS and 3DIC NPI project process evaluation and new material feasibility evaluation.  Support new facility build-up from scratch P11B.  New tool survey, evaluation. Specification definition and implement.

Senior Engineer, Process Engineering Dept. (Report to Director, lead 2 members) Responsible for WLCSP facility build up from scratch. Mainly responsible for wet process, Ball mount, Ball repair, UBM etching, PR stripper and reflow. Support photo process management. Process integration. o Cross-functional coordination between PM, Manufacturing and Equipment. In charge of all audit and customer incident for key account. Lead 2 members for project management and… Show more Senior Engineer, Process Engineering Dept. (Report to Director, lead 2 members) Responsible for WLCSP facility build up from scratch. Mainly responsible for wet process, Ball mount, Ball repair, UBM etching, PR stripper and reflow. Support photo process management. Process integration. o Cross-functional coordination between PM, Manufacturing and Equipment. In charge of all audit and customer incident for key account. Lead 2 members for project management and coach technical skill as well as support manager KPI scoring.Achievement: Yield improvemento Implement PR stripper w/o DMSO/ NMP for meeting EU Norms. Cost saving by 25%.o Implement low-cost solder ball replacing higher price material. Cost saving 60%. Show less

Engineer, Process Engineering Dept. (report to manager, lead 3 members) Responsible for die preparing such as grinding, singulation, laser grooving, die bonding including flip chip and die attach film. In charge of audit and customer incident for key accounts. Implement flip chip and laser grooving. Lead 3 members for project management and coach technical skill as well as support manager KPI scoring.

Onsite PTI for technical transfer  In charge of WLCSP technical transfer from PTI to Greatek. Responsible for all WLCSP process both wet and dry as well as DPS. Established and implemented OI specification. Survey, evaluate and implement equipment by cooperating with vendors.