劉碩翰 Email & Phone Number

台灣 桃園市

Mainly in charge of the following KA in the medical & IOT industry. Created the thermal solution from the system-level perspective to optimize product performanceAlign:  Provided the thermal solution and flow field placement design solution.The system performance increased up to 46.1%, Acoustic reduced 12.3%, which is beyond customer’s expectation.  Designed the thermal solutions to help win the project of 2 generations, which bring top one revenue in the BU. Won the best designer Award of project in 2020 Won the A+ Model Award in 2020Bard:  Designed the thermal solution for system that needs to perform under a very low temperature from -10 to -40 degrees.  Improved the thermal solution of 1st generation product to increase the system performance by 16.6%  Strengthened the product’s reliability life from 3 to 5 years by the designed thermal solution and under the wide operating temperature from -40 to 25 degrees. Komatsu (IOT product)  Provided the reliable thermal solution for systems used on excavator that can withstand the high temperature of 50-60 degree and also frequent shock & vibration in the outdoor environment. GE (Medical display) Proposed the new thermal solution to replace the previous one to make system’s reduce thickness by 25%FKSystem (IOT) Offered the professional thermal solution to help customer reduce system’s thickness by 40.5% and increase the performance by 23.4%.  Won the best designer Award of project in 2021 Won the A+ Model Award in 2021In period of work at Advantech has no any thermal issue complain from customers

台灣 New Taipei City 汐止區

Mainly incharge project leadership of custom-designed thermal solution development Lenovo(Japan YMT_Lad) Working station : PadmeProposed SSD degradation solution to avoid SSD performance damage issue and to keep performance around 90%~95%  X1_Yoga_Raven (2nd & 3rd generation)Optimized the fan table value to make noise level decrease by 4.3%Optimized the sticker solution to save cost of 320,000 USD per yearImplemented the intelligent cooling solution to make sound pressure level decrease by 13.3% X1 Fuji Proposed the VC + Graphite solution to make thickness overall decrease by 40% and reduce the weight of thermal solution by 53.3% Rainier (Won Red dot award)Optimized the fan flow field & fan table value to make the fan noise reduce by 8.5% and keep the fan performance Lenovo(Beijing) LKL-1 Optimized the system fan flow to make system performance increase by 9.4% from the previous generation Fine-tuned the pipe water volume parameter to ensure that the pipe can stand CPU Turbo without the pipe dry-out issue  Leia Proposed a more cost-effective solution to reduce the cost by 2.7% and module weight by 19.3% and also keep skin temperature under criteria HP (U.S.)Suggested the 3D VC concept within system to solve the different layer heating source on the product