Ai Technology, Inc.

Ai Technology, Inc. company information, Employees & Contact Information

AI Technology, Inc. has more than 25 years of experience and success in helping military, aerospace, computer, and super-computer manufacturers with thermal compound and thermal interface materials for building some of the most reliable electronic devices and computers. Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology, Inc. has been one of the leading forces in development of patented applications of advanced material and adhesive solutions for electronic interconnection and packaging. The company continues to provide adhesive solutions for component and substrate bonding for both military and commercial applications. It's thermal interface material solutions of patented phase-change thermal pads, thermal grease and gels and thermal adhesives set many bench marks of performance and reliability for power semiconductor and modules, computer and communication electronics.

Company Details

Employees
44
Founded
-
Address
70 Washington Road, Princeton Junction,new Jersey 08550,united States
Phone
16097999308
Email
ai****@****ogy.com
Industry
Chemical Manufacturing
NAICS
Chemical Manufacturing
Soap, Cleaning Compound, and Toilet Preparation Manufacturing
Other Chemical Product and Preparation Manufacturing
Printing Ink Manufacturing
Explosives Manufacturing
All Other Chemical Product and Preparation Manufacturing
Custom Compounding of Purchased Resins
Photographic Film, Paper, Plate, and Chemical Manufacturing
All Other Miscellaneous Chemical Product and Preparation Manufacturing
HQ
Princeton Junction, New Jersey
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News

Making Science launches RAISING, its new AI technology division to power marketing strategies - Business Wire

Making Science launches RAISING, its new AI technology division to power marketing strategies Business Wire

AI Technology, Inc. (AIT) Introduces Temporary Bonding Adhesive for Thin Wafer Handling - PR Newswire

AI Technology, Inc. (AIT) Introduces Temporary Bonding Adhesive for Thin Wafer Handling PR Newswire

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