Amkor Technology Portugal S.A

Amkor Technology Portugal S.A company information, Employees & Contact Information

Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor’s operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor's leadership in continuous technology innovation.

Company Details

Employees
272
Founded
-
Address
Av. Primeiro De Maio, 801, Vila Do Conde,4485-629,portugal
Industry
Appliances, Electrical, And Electronics Manufacturing
NAICS
Electrical Equipment, Appliance, and Component Manufacturing
Other Electrical Equipment and Component Manufacturing
Battery Manufacturing
Communication and Energy Wire and Cable Manufacturing
Wiring Device Manufacturing
All Other Electrical Equipment and Component Manufacturing
Storage Battery Manufacturing
Primary Battery Manufacturing
Fiber Optic Cable Manufacturing
Other Communication and Energy Wire Manufacturing
Current-Carrying Wiring Device Manufacturing
Noncurrent-Carrying Wiring Device Manufacturing
Carbon and Graphite Product Manufacturing
All Other Miscellaneous Electrical Equipment and Component Manufacturing
Website
nanium.com
HQ
Vila do Conde
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News

FlipChip International and NANIUM S.A. Announce License, Sales and Marketing Agreements for 300mm Wafer Level Packaging Services - PR Newswire

FlipChip International and NANIUM S.A. Announce License, Sales and Marketing Agreements for 300mm Wafer Level Packaging Services PR Newswire

AMKOR TECHNOLOGY, INC. SEC 10-Q Report - TradingView

AMKOR TECHNOLOGY, INC. SEC 10-Q Report TradingView

Wafer-level SiP yields 5X footprint reduction ... - eeNews Europe

Wafer-level SiP yields 5X footprint reduction ... eeNews Europe

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