Advanced equipment manufacturer, wafer level packaging (WLP) subcontracting service provider and chemistry supplier specialized in electroless under bump metallization (UBM), solder balling and back-end services with more than 25 years of experience after spinning off from the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Germany.
Mother company: Nagase & Co., Ltd. with headquarters in Tokyo, Japan
Facilities: Nauen, Germany (headquarters), Santa Clara, CA, USA & Penang, Malaysia
Company Details
- Employees
- 90
- Address
- Am Schlangenhorst, Nauen,brandenburg 14641,germany
- Industry
- Semiconductor Manufacturing
- NAICS
-
Semiconductor and Other Electronic Component Manufacturing
- HQ
- Nauen, Brandenburg
Pactech - Packaging Technologies Questions
Pactech - Packaging Technologies's LinkedIn profile is https://www.linkedin.com/company/pactech-packaging-technologies
Pactech - Packaging Technologies has
90 employees.
View email and phone details for 90
employees at Pactech - Packaging Technologies.
Pactech - Packaging Technologies's industry is
Semiconductor Manufacturing
Pactech - Packaging Technologies's top competitors are
Amec (Advanced Micro-Fabrication Equipment Inc. China),
Asymtek,
Nagase & Co., Ltd.,
Ev Group,
Jabil,
Pac Tech Gmbh,
Jpcpt,
Pactech Solutions,
Tresky Automation,
Intel Corporation.
Pactech - Packaging Technologies's categories are Semiconductor Manufacturing
