Company

PacTech - Packaging Technologies

Semiconductor Manufacturing Nauen, Brandenburg, De 90 employees

Employees: 90
Contacts: 1
Emails: 1
Phones: 1

PacTech - Packaging Technologies Overview

Headquarters: Nauen, Brandenburg, De
Industry: Semiconductor Manufacturing
Employees: 90
NAICS: Semiconductor and Other Electronic Component Manufacturing

Keywords

provider and chemistry supplier specialized in electroless under bump metallization (UBM)

About PacTech - Packaging Technologies

Advanced equipment manufacturer, wafer level packaging (WLP) subcontracting service provider and chemistry supplier specialized in electroless under bump metallization (UBM), solder balling and back-end services with more than 25 years of experience after spinning off from the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Germany. Mother company: Nagase & Co., Ltd. with headquarters in Tokyo, Japan Facilities: Nauen, Germany (headquarters), Santa Clara, CA, USA & Penang, Malaysia

PacTech - Packaging Technologies Contact Details

People in AeroLeads: 4
With contact data: 1
Email contacts: 1; 25.0% coverage
Phone contacts: 1; 25.0% coverage

PacTech - Packaging Technologies Org Chart

Sample employees and titles

Name	Title	Location	Contact
Neil M Macraild	Pactech Usa Inc.		View
Joel Stojkovic	Sales Manager at Proampac		View
Kohei Suzuki	Sales Manager – Equipment & Bumping	Berlin Metropolitan Area, Germany	View
John Ferber	Semi Retired	Rochester, New York, United States	Email Phone