RAM Innovations provides R&D and manufacturing services to the semiconductor and electronics industries. We are experts in Heterogeneous PCB embedded die packaging (EDP), collaborating with partners at the leading edge of semiconductor development and have designed and manufactured a number of power conversion modules based on this technology.
We also provide a range of other services including flip chip, die placement and bonding, chemical processing and plating as well as embedded power module design.
We are a growing business and are continually looking for talented individuals to join our team. Please feel free to send a CV and message if you are interested in joining our team.
If you are a recruitment agency please do not send us any CVs without agreeing terms first.
Company Details
- Employees
- 11
- Founded
- -
- Address
- Unit F Pentre Industrial Estate, Chester Road, Pentre, Deeside,flintshire Ch5 2dq,united Kingdom
- Industry
- Semiconductor Manufacturing
- NAICS
-
Semiconductor and Other Electronic Component Manufacturing
- Website
- ram-innovations.com
- HQ
- Deeside, Flintshire
Ram Innovations Questions
Ram Innovations's website is ram-innovations.com
Ram Innovations's LinkedIn profile is https://uk.linkedin.com/company/ram-innovations-ltd
Ram Innovations has
11 employees.
View email and phone details for 11
employees at Ram Innovations.
Ram Innovations's industry is
Semiconductor Manufacturing
Ram Innovations's top competitors are
Space Forge,
Cambridge Gan Devices Ltd,
Csconnected,
Gas Sensing,
Compound Semiconductor Applications (Csa) Catapult,
Clas-Sic Wafer Fab Ltd,
Hypercim Ltd,
Advancete Limited,
Kuasasemi Ltd,
Osi Electronics.
Ram Innovations's categories are Semiconductor Manufacturing
Ram Innovations's founding year is 2011
