Sysmetric-TFS

Sysmetric-Thermal Forcing System (TFS) develops and manufactures high-efficiency Thermal solutions for Semiconductor validation centers and medical and Automotive Labs that require precise temperature control in the range of -60c to 150c using Vapor compression technology. Our products are distributed in the USA, Central America, Europe, the Middle East, India, Malaysia, and Japan with support Centres in the USA, Middle East, and India. Sysmetric- Thermal Forcing Systems is open for “Win-Win” cooperation in the field of development, prototyping, and production. The demand for high-performance microprocessors has resulted in an escalation of power dissipation and heat flux at the silicon level. High Si temperature causes various problems such as increased leakage, accelerating failure mechanisms, and influence timing failures. The tests have to be conducted to get the necessary data to show any gaps between the spec provided by the vendor and the actual product. The desire for small form-factor chassis and new car industry specification demand for very low and very high Silicon operating temperatures bring the thermal solution challenge to new levels. Silicon validation platforms are built to validate Processors, Chipset, and PCB’s to ensure quality and reliable products in a temperature range of -40c to 125c. This validation phase is a crucial step in releasing the product to market. Recently it become challenging to design a forcing thermal solution for high-speed processors, network components, Graphic cards, Memory voltage regulators, etc. Thermal-related effects are considered a major roadblock in the design of next-generation microprocessors.