AI Cluster Copper and Optical Connectivity with lower power and better performance

Empowered by the the packaging library and processing techniques based design automation flow, Wandtec pioneers in the software-defined 3D high-speed cable engineering and manufacturing services for 56Gbps+ AI cluster and datacom infrastructure where the integration of cable, connector and PCBA is critical. Wandtec also integrates artificial intelligence (AI) manufacturing technologies for the high-speed cable/connector/PCB interconnects. The software-defined design-to-manufacturing flow enables Wandtec to deliver new interconnect solutions to customers from concepts to production as little as two months. By engineering the most advanced low power, low latency and bending insensitive infrastructure passive and active copper cable assemblies, Wandtec helps the industry accelerating the AI infrastructure and datacenter builds with higher than the industry's standards. Product Highlights: * 25G-100G Direct Attached Cable and Active Direct Attached Cable up to 10m; * 50G-400Gbps DAC and ADAC in form factor of QSFPDD/OSFP/SFPDD/DSFP/QSFP56/SFP56, the world's only complete solution provider in the market as of 2021. * 50G-400G Active Optical Cable based on low latency, low power Linear driver solutions. * 400G/800G DAC/ACC/AEC in OSFP/QSFPDD/QSFP112 form factors up to 2m passive and 5m active. * PCIe CEM-to-Any riser cable series for PCIe Gen5/Gen6: the ultimate solutions for storage, PCIe add-in cards, PCIe accessaries, AI servers. Interface includes QSFP/QSFPDD/OSFP/SFF8654/SFF8643/TA1002/TA1020/GenZ etc. * Custom over-the-board high-speed cable interconnects for 20Gbps+