Adarsh Das
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Adarsh Das Email & Phone Number

Package Developement Engineer at Boschman Advanced Packaging Technology
Location: Arnhem, Gelderland, Netherlands 7 work roles 2 schools
1 work email found @boschman.nl LinkedIn matched
✓ Verified August 2026 4 data sources Profile completeness 86%

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Current company
Boschman Advanced Packaging Technology
Role
Package Developement Engineer
Location
Arnhem, Gelderland, Netherlands
Company size
85 employees

Who is Adarsh Das? Overview

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Adarsh Das is listed as Package Developement Engineer at Boschman Advanced Packaging Technology, a with 85 employees, based in Arnhem, Gelderland, Netherlands. AeroLeads shows a work email signal at boschman.nl and a matched LinkedIn profile for Adarsh Das.

Adarsh Das previously worked as Process Engineer at Boschman Advanced Packaging Technology and Junior Process Engineer at Boschman Advanced Packaging Technology. Adarsh Das holds Bachelor Of Science, Mechanical Engineering, 2.0 from Rhine-Waal University.

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{first}{last}@boschman.nl
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About Adarsh Das

At Boschman Advanced Packaging Technology, our team has pioneered enhancements in power module packaging, focusing on back-end processes like Sintering , Molding and Die attach. Our efforts have markedly improved product performance and reliability. With a Bachelor of Science in Mechanical Engineering from Rhine-Waal University, I bring a strong analytical foundation to our projects, utilizing Statistical Analysis to refine manufacturing processes.Leveraging skills in SOLIDWORKS alongside industry-specific knowledge in Film Assisted Molding and Silver and copper Sintering, I have contributed to elevating our R&D initiatives. My commitment lies in developing solutions that resonate with the evolving needs of the semiconductor sector. I stay current with technological advancements, ensuring that our approaches remain at the forefront of the industry.

Current workplace

Adarsh Das's current company

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Boschman Advanced Packaging Technology
Boschman Advanced Packaging Technology
Package Developement Engineer
Arnhem, GE, NL
Website
boschman.nl
Employees
85
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7 roles

Adarsh Das work experience

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Process Engineer

Current
Boschman Advanced Packaging Technology

Duiven, Gelderland, Netherlands

Key Contributions:-worked with a team of engineers and technicians in the successful execution of R&D projects focused on enhancing power module packaging.-Developed and optimized back-end processes including Sintering, Die attach, and Molding, resulting in improved product performance and reliability.-Conducted thorough research on emerging materials, evaluating their feasibility and impact on power module manufacturing.-Designed and implemented efficient Design of Experiments (DOEs) to systematically analyze process variables and optimize manufacturing outcomes.

May 2023 - Present

Junior Process Engineer

Boschman Advanced Packaging Technology

Duiven, Gelderland, Netherlands

● Core focus in Film Assisted Molding and Package Attach Sintering.● In-depth knowledge in the field of wire bonding, dispensing, die attach, flip chip and TSV’s.● Experience in destructive testing & non-destructive testing such as CSAM, Xray, Shear testing and Wire Pull.

Oct 2022 - Apr 2023

Semiconductor Packaging

Citc - Chip Integration Technology Center

Nijmegen, Gelderland, Netherlands

• Experience in the field of Front-End and Back-End Semiconductor industry• Gathered Knowledge on Encapsulation technologies.• Reviewed literature on reliability and advanced material science.• Simulation of IC’s in Marc Mentat.

Sep 2021 - Jan 2022

Student Research Assistant

Rhine-Waal University

Cleves, North Rhine-Westphalia, Germany

• Creating an FDM model for quenching metals using Excel and MATLAB.• Quenching simulation of metals using ANSYS.• Reviewed research papers and gathered information.• Acquired skills in writing research papers using Latex.• Created scientific figures using Inscape

Jul 2021 - Nov 2021

Bachelor Thesis

Rhine-Waal University

Cleves, North Rhine-Westphalia, Germany

Worked on my bachelor thesis in the field of Heat Transfer & Metallurgy. Transient Thermal Analysis simulations were done in ANSYS WORKBENCH 21.Thesis title: Investigation of the impact of material selection between 20MnCr5 and 42CrMo4 on quenched notched metallic samples using Finite Element Analysis.Supervised by: Prof. Dr.-Ing. Peter Kisters & Phyllis Ndugire

Apr 2021 - Jul 2021
Team & coworkers

Colleagues at Boschman Advanced Packaging Technology

Other employees you can reach at boschman.nl. View company contacts for 85 employees →

JY Jae Young Kim Jae Young Kim Colleague at Boschman Advanced Packaging TechnologySouth Korea, Korea, Republic Of View → WM Wayne Mu Wayne Mu Colleague at Boschman Advanced Packaging TechnologyDuiven, Gelderland, Netherlands View → EH Erik Hakstege Erik Hakstege Colleague at Boschman Advanced Packaging TechnologyZevenaar, Gelderland, Netherlands View → PD Peter De Bruin Peter De Bruin Colleague at Boschman Advanced Packaging TechnologyArnhem-Nijmegen Region, Netherlands View → DV Dick Van Leeuwen Dick Van Leeuwen Colleague at Boschman Advanced Packaging TechnologyUbbergen, Gelderland, Netherlands View → TR Tejasvi Rasgotra Tejasvi Rasgotra Colleague at Boschman Advanced Packaging TechnologyArnhem, Gelderland, Netherlands View → JH Jianye He Jianye He Colleague at Boschman Advanced Packaging TechnologySuzhou, Jiangsu, China View → HH Hailin Hu Hailin Hu Colleague at Boschman Advanced Packaging TechnologyWuxi, Jiangsu, China View → LC Lim Chin Yuan Lim Chin Yuan Colleague at Boschman Advanced Packaging TechnologySingapore View → VT Vincent Tap Vincent Tap Colleague at Boschman Advanced Packaging TechnologyGaanderen, Gelderland, Netherlands View →
2 education records

Adarsh Das education

FAQ

Frequently asked questions about Adarsh Das

Quick answers generated from the profile data available on this page.

What company does Adarsh Das work for?

Adarsh Das works for Boschman Advanced Packaging Technology.

What is Adarsh Das's role at Boschman Advanced Packaging Technology?

Adarsh Das is listed as Package Developement Engineer at Boschman Advanced Packaging Technology.

What is Adarsh Das's email address?

AeroLeads has found 1 work email signal at @boschman.nl for Adarsh Das at Boschman Advanced Packaging Technology.

Where is Adarsh Das based?

Adarsh Das is based in Arnhem, Gelderland, Netherlands while working with Boschman Advanced Packaging Technology.

What companies has Adarsh Das worked for?

Adarsh Das has worked for Boschman Advanced Packaging Technology, Citc - Chip Integration Technology Center, Rhine-Waal University, and Mercedes-Benz India Pvt. Ltd..

Who are Adarsh Das's colleagues at Boschman Advanced Packaging Technology?

Adarsh Das's colleagues at Boschman Advanced Packaging Technology include Jae Young Kim, Wayne Mu, Erik Hakstege, Peter De Bruin, and Dick Van Leeuwen.

How can I contact Adarsh Das?

You can use AeroLeads to view verified contact signals for Adarsh Das at Boschman Advanced Packaging Technology, including work email, phone, and LinkedIn data when available.

What schools did Adarsh Das attend?

Adarsh Das holds Bachelor Of Science, Mechanical Engineering, 2.0 from Rhine-Waal University.

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