Engineering Manager - Ic Packaging
Current
Feb 2024 - Present
AeroLeads people directory · profile
Aditya Vaidya Email & Phone Number
Engineering Manager - IC Packaging
at
Intel Corporation
LinkedIn matched
✓ Verified Jul 2026
3 data sources
Profile completeness 100%
Current company
Role
Engineering Manager - IC Packaging
Location
Gilbert, Arizona, United States
Company size
Who is Aditya Vaidya? Overview
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Quick answer
Aditya Vaidya is listed as Engineering Manager - IC Packaging at Intel Corporation, a with 10 employees, based in Gilbert, Arizona, United States. AeroLeads shows a matched LinkedIn profile for Aditya Vaidya.
Aditya Vaidya previously worked as Senior Packaging Engineer at Intel Corporation and Packaging Engineer at Intel Corporation. Aditya Vaidya holds Master’S Degree, Civil Engineering; Structural Engineering; Finit Element; Composite Materials from Arizona State University.
Company email context
Email format at Intel Corporation
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Intel Corporation
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Profile bio
About Aditya Vaidya
.
Listed skills include Solidworks, Matlab, Simulations, Finite Element Analysis, and 13 others.
Current workplace
Aditya Vaidya's current company
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Intel Corporation
5 roles
Aditya Vaidya work experience
A career timeline built from the work history available for this profile.
Senior Packaging Engineer
* Responsible for working with product, packaging and manufacturing teams to design market leading SoC packages* Work with cross-functional teams to deliver aggressive and robust package design to meet customer requirements* Coordinate with manufacturing teams to establish process flows, manage build volumes through factory and lead cross functional teams to fix any assembly or reliability issues* Plan the product life cycle from definition to high volume manufacturing readiness
Oct 2015 - Feb 2024
Packaging Engineer
* Provided mechanical guidance to design and manufacturing teams to design thin, robust and reliable packages in tablet, laptop and desktop segments* Performed mechanical modeling (FEA) to recommend package architectures and material sets which are aggressive, reliable and competitive from cost perspective* Developed analysis methodologies to help risk assess package for thermo-mechanical stresses, surface mount capability and solder joint reliability* Served as industry mentor for microelectronic packaging class offered at Arizona State University* Lead author on 3 and co-author on 3 papers published in Intel internal journal* Won 2 Department Recognition Awards for mechanical modeling work* Hold 2 US patents related to package warpage control and novel materials for warpage, thermal and interconnect solutions
Feb 2011 - Oct 2015
Senior Design Project
* Designed systems for auto loading, unloading and transfer of tubes in a Tube Bending Cell with an aim of saving time, increasing productivity and improving efficiency* Performed time study, motion study, layout analysis etc.
Aug 2007 - Feb 2008
Summer Intern
* Designed a magazine fixture with a capacity of 100 nuts which fed a machine so as to operate continuously against previous solution requiring a worker to load the nuts to the machine manually* Initial prototype designed using Solid works and tested on the shop floor
May 2007 - Jun 2007
Team & coworkers
Colleagues at Intel Corporation
Other employees you can reach at intel.com. View company contacts for 10 employees →
HW
Huilin Wen
Colleague at Intel CorporationLiaoning, China
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EL
Eli Lugasi
Colleague at Intel CorporationIsrael
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EM
Erez Milrad
Colleague at Intel CorporationNorth District, Israel
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AS
Ahmad Sufian
Colleague at Intel CorporationKulim District, Kedah, Malaysia
View →
YS
Yan Song
Colleague at Intel CorporationAustin, Texas, United States
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MM
Mohamad Mukhlis Baharudin
Colleague at Intel CorporationPenang, Malaysia
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JF
Jackie Frazier
Colleague at Intel CorporationPortland, Oregon, United States
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M(
Miroslav (Miro) Shapiro
Colleague at Intel CorporationHaifa District, Israel
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AS
Aaron Sauer
Colleague at Intel CorporationPortland, Oregon Metropolitan Area, United States
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KM
Kapilan Maheswaran
Colleague at Intel CorporationBeaverton, Oregon, United States
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Huilin Wen
Colleague at Intel CorporationLiaoning, China
View →
EL
Eli Lugasi
Colleague at Intel CorporationIsrael
View →
EM
Erez Milrad
Colleague at Intel CorporationNorth District, Israel
View →
AS
Ahmad Sufian
Colleague at Intel CorporationKulim District, Kedah, Malaysia
View →
YS
Yan Song
Colleague at Intel CorporationAustin, Texas, United States
View →
MM
Mohamad Mukhlis Baharudin
Colleague at Intel CorporationPenang, Malaysia
View →
JF
Jackie Frazier
Colleague at Intel CorporationPortland, Oregon, United States
View →
M(
Miroslav (Miro) Shapiro
Colleague at Intel CorporationHaifa District, Israel
View →
AS
Aaron Sauer
Colleague at Intel CorporationPortland, Oregon Metropolitan Area, United States
View →
KM
Kapilan Maheswaran
Colleague at Intel CorporationBeaverton, Oregon, United States
View →
2 education records
Aditya Vaidya education
Master’S Degree, Civil Engineering; Structural Engineering; Finit Element; Composite Materials
Arizona State University
Bachelor’S Degree, Mechanical Engineering
University Of Mumbai
FAQ
Frequently asked questions about Aditya Vaidya
Quick answers generated from the profile data available on this page.
What company does Aditya Vaidya work for?
Aditya Vaidya works for Intel Corporation.
What is Aditya Vaidya's role at Intel Corporation?
Aditya Vaidya is listed as Engineering Manager - IC Packaging at Intel Corporation.
Where is Aditya Vaidya based?
Aditya Vaidya is based in Gilbert, Arizona, United States while working with Intel Corporation.
What companies has Aditya Vaidya worked for?
Aditya Vaidya has worked for Intel Corporation, Godrej And Boyce (Furniture Division), and Godrej And Boyce (Locks Division).
Who are Aditya Vaidya's colleagues at Intel Corporation?
Aditya Vaidya's colleagues at Intel Corporation include Huilin Wen, Eli Lugasi, Erez Milrad, Ahmad Sufian, and Yan Song.
How can I contact Aditya Vaidya?
You can use AeroLeads to view verified contact signals for Aditya Vaidya at Intel Corporation, including work email, phone, and LinkedIn data when available.
What schools did Aditya Vaidya attend?
Aditya Vaidya holds Master’S Degree, Civil Engineering; Structural Engineering; Finit Element; Composite Materials from Arizona State University.
What skills is Aditya Vaidya known for?
Aditya Vaidya is listed with skills including Solidworks, Matlab, Simulations, Finite Element Analysis, Testing, Ansys, Modeling, and Manufacturing.
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