* Responsible for working with product, packaging and manufacturing teams to design market leading SoC packages* Work with cross-functional teams to deliver aggressive and robust package design to meet customer requirements* Coordinate with manufacturing teams to establish process flows, manage build volumes through factory and lead cross functional teams to fix any assembly or reliability issues* Plan the product life cycle from definition to high volume manufacturing readiness

* Provided mechanical guidance to design and manufacturing teams to design thin, robust and reliable packages in tablet, laptop and desktop segments* Performed mechanical modeling (FEA) to recommend package architectures and material sets which are aggressive, reliable and competitive from cost perspective* Developed analysis methodologies to help risk assess package for thermo-mechanical stresses, surface mount capability and solder joint reliability* Served as industry mentor for microelectronic packaging class offered at Arizona State University* Lead author on 3 and co-author on 3 papers published in Intel internal journal* Won 2 Department Recognition Awards for mechanical modeling work* Hold 2 US patents related to package warpage control and novel materials for warpage, thermal and interconnect solutions

* Designed systems for auto loading, unloading and transfer of tubes in a Tube Bending Cell with an aim of saving time, increasing productivity and improving efficiency* Performed time study, motion study, layout analysis etc.

* Designed a magazine fixture with a capacity of 100 nuts which fed a machine so as to operate continuously against previous solution requiring a worker to load the nuts to the machine manually* Initial prototype designed using Solid works and tested on the shop floor