Andrea Cloutier Email & Phone Number

Sunnyvale, CA, US

Device Packaging Experience (DPX)

North Reading, MA, US

• Lead a small Hardware (HW) and Software (SW) Technical Program Management (TPM) and Integration Management team for Micro Fulfillment within the AR organization while maintaining personal project management.
• Drove and worked with the team to deliver a back-of-house automation S-Team goal in 2022 with a main focus to reduce operating and labor cost.
• Drove and worked with the team to deliver an Automated Storage and Retrieval System (ASRS) prototype within 15 weeks of design lock. The prototype included a tote handling telescoping mechanism integrated to a Drive.
• Provided OP resourcing and budget estimations for Micro Fulfillment including inputs from teams across the AR organization.

Sunnyvale, CA, US

• Led a 5-person TPM and Engineering Program Specialist (EPS) team for the Lab126 Devices organization while maintaining personal project management responsibilities. Also led the full HW Development team of 24 people.
• Actively drove the Product Development Process (PDP) from concept to mass production from the overall HW and SW system standpoint, aligning cross-functional teams through pre-production validation builds and into Mass.
• Collaborated and communicated across Engineering, Operations, and senior executive levels to drive key project decisions while keeping the budget and schedule intact.
• Drove and delivered the Halo View Fabric Band design from concept to MP within 9 months to meet customer requests.
• Managed the Bellevue HW team OP budget, New Product Introduction (NPI) build budgets, and program resourcing estimates, including monthly program level resource accounting.
• Drove the Design portion of the Supplier Business Review (SBR) for one of five critical Contract Manufacturers (CM) twice per year across all Amazon Devices programs.

Seattle, WA, US

• Worked on multiple projects to facilitate the completeness, consistency and correctness of Amazon’s Softlines (SL) catalog.
• Global Point of Contact (POC) for driving global alignment in apparel size customer-facing detail page improvements. This effort includes a new seller-facing listing experience and standardization of existing catalog.
• Co-creation and implementation of a detailed project template to identify dependencies and key stakeholders to meet aggressive defect-free catalog data goals.

Sunnyvale, CA, US

• Led a 3-person Industrial Design Technical Program Management (ID TPM) team for all devices designed at Lab126 including special projects with AWS, Ring and Blink while maintaining personal project management.
• Actively drove the industrial design process from concept to lock by managing the "how and when" of each project.
• Collaborated and communicated across the organization and up to the senior executive levels to align on key project decisions while minimizing schedule impact.
• Maneuvered through each project's complexity to drive two-way door decisions often creating unique solutions.

San Francisco, CA, US

Led a 2-person Program Management team for the 2nd generation Here Two product. Responsible for driving product architecture definition, estimated BOM with cost structure, HW/SW schedule for the product with cross-functional team collaboration and Contract Manufacturer (CM) selection with set-up for New Product Introduction (NPI) builds and Mass Production.

San Francisco, CA, US

• Hardware team member in a 60-person start-up creating a product for the Augmented Reality (AR) wireless headphone space (Here One).
• Owned design and manufacture of product charging case, including overall system mechanical integrity, physical connectivity and Color Material Finish (CMF) for the product. Implemented a Project Lifecycle Management.
• Additional responsibilities included assisting the EPM to ensure the product manufacturing process was implemented in the factory to meet MP dates, mentoring junior engineers and maintaining a 400+-part BOM.

Sunnyvale, CA, US

• Lead a team of Mechanical Program Managers for entire consumer product portfolio while maintaining personal project leadership responsiblities. The team's coverage includes Tablets, E-readers, Echo, Fire TV and.
• Lead daily/weekly meetings between Product Design & the cross-functional teams.
• Drive prototype and development build definition as needed to support engineering evaluations & Plan of Record configurations.
• Drive material to support build activities in conjunction with China team members, Contract Manufacturers & suppliers.
• Lead engineering development builds at CMs and attend as needed.
• Drive BOM structure/3D/2D release & lifecycle changes.

Sunnyvale, CA, US

• Senior Mechanical Program Manager for the 2 Amazon Fire HD Tablets (6" & 7") released in 2014.
• Coordinated efforts between internal cross-functional teams, resin suppliers, molding suppliers and Contract Manufacturer to match, validate and qualify 5 colors in less than 5 months for both new Fire HD Tablets. This.
• Drive material, DOEs and Reliability requirements with the cross-functional team and CM in order to meet product qualification requirements throughout the development cycle and into product ramp.
• Create and drive the mechanical design schedule for 3 tablet programs, working in conjunction with the System Level Engineering Program Manager to align with the overall program schedule.
• Lead and participate in multiple Executive and Leadership Team reviews throughout the project lifecycle.
• Participate in mulitple process initiatives across the organization to improve internal system flow.

Waterloo, Ontario, CA

Project Lead for the mechanical team working on the next generation of BlackBerry smartphones. The point contact for all mechanical engineering items throughout the development cycle, ramp and initial product introduction to the target markets.Drive engineering schedule to meet carrier lab schedules, Marketing commitments and first carrier.

Waterloo, Ontario, CA

Key member of the mechanical development team responsible for creating the next generation of BlackBerry Curve consumer handsets, models 8520, 8530, 9220, 9300, 9310, 9320 & 9330 and new BB10 Z30 handset. Worked in tandem with the Mechanical Lead to ensure the design objectives were met and communicated to external teams for alignment.Created and executed.

Owned and operated a mechanical engineering consulting business generating over $100k of revenue per year providing services from concept to mass production.Marketing of engineering services to potential clients which included attending local inventor club, chamber of commerce and meet & greet outings.Assessed and developed design strategies and schedules.

Design team leader for multiple Connector and Very Small Peripheral Array (VSPA) projects. Responsibilities included new design and development of injection molded plastic and formed metal components for a new family of high density PC card connectors and IC packages.Extensive involvement in cross-functional teams with vendors and manufacturing.Developed.

Chicago, Illinois, US

Key member of a product development group that completed rapid projects on time meeting cost goals and maintained cost reduction efforts and resolution of warranty issues for a high volume alpha-numeric pager.Wrote a business plan for a Design Center in the Dublin, Ireland manufacturing site with specific direction to design products for the EMEA markets.

Msem, Engineering Management

Bsme, Design