Serve as the primary expert for advanced packaging wafer-level assembly polymer materials, setting the strategic vision and leading pathfinding efforts. Develop and implement comprehensive sourcing strategies, ensuring alignment with technology development objectives and material supplier capabilities. Drive the selection and qualification of materials and suppliers, optimizing the integration of polymer materials into advanced packaging processes to achieve superior performance and cost efficiency.

Ensured material supply chain readiness for the ramp-up of leading technology nodes. Led the qualification process for materials and implemented risk mitigation strategies for both new and legacy materials. Oversaw the excursion control and yield improvement roadmaps for Fab materials.

Coordinated the evaluations and development of CMP materials for both Technology Development and Manufacturing teams. Spearheaded continuous improvement initiatives for chemicals and consumables, while overseeing all technical aspects of supplier management for Intel’s advanced logic technologies.

Wet Etch Module Team Lead - Process transfer from Technology Development to Ramp/High Volume for 32 nm and 22 nm process nodes. Equipment owner for 4 unique toolsets.