Andrew Phillips Email & Phone Number

Hewlett Packard Inc, Corvallis, Or

Reliability Engineering for production and development of inkjet print-heads. Dynamics testing, Environmental Testing and Material Compatibility Testing of inkjet print-heads and related hardware. Supporting the development of page wide array print-heads and 3D printing.

Corvallis, Oregon

At Innovative Etch we use the technology of sandblasting to create artworks which are architectural, functional or purely decorative. Our focus is on working with customers to create unique and personal pieces on various types of media. Graphics can be provided, or we can create them.In the design phase we leverage various techniques such as vector art generation, digital image manipulation, half-toning, etc. Etching is achieved using single level or multi-layering techniques and adapted to the specific material.The website can be found at http://innovativeetch.com or click link in contact information.

Corvallis, Or

Audio And MIDI Solutions provides services related to the processing of audio, MIDI and image related data. Services provided relate to the processing of digital data coupled with expertise in musicology, music recording, music performance, color science and imaging.The website can be found at http://audioandmidisolutions.com or click link in Contact Information.

Corvallis, Oregon Area

Amorphyx revolutionizes the manufacture of liquid crystal-based (LED, LCD) and organic LED (OLED) flat panel display (FPD) backplanes by leveraging breakthroughs in the use and manufacture of amorphous metals developed by its founders as part of their doctoral research at Oregon State University. The company's initial product - a two-terminal thin-film nonlinear device called the Amorphous Metal Nonlinear Resistor (AMNR), PECVD-based manufacturing process, and subpixel circuit - utilizes existing FPD backplane manufacturing equipment for smartphones, laptops, tablets, monitors and television displays. This same product promises to be the critical enabler of the mass production of flexible displays

Corvallis, Oregon

Integration support on various Micro-Electro-Mechanical (MEMS) product developments including phase change memory chip, inkjet printheads, optical imaging chip and accelerometer. * Provided a cross functional interface between the Fab and R&D Engineers to facilitate design improvements, process development and reliability assessment of a novel page-wide array printhead. * Lead a team of integration engineers, ink chemists and writing system engineers through ink development cycles, selection processes and final ink freeze. * Developed and managed test methods and data analysis tools for an automated test for a page-wide inkjet printhead. Managed the test area and transferred processes to a Singapore manufacturing site. * Fab integration support for complex MEMS based memory chip including working with an Outsource supplier on a Montecarlo based reliability model. * Awarded HP Fellowship for on-site study at University of Illinois (8/13/2001 to 5/21/2002) * Lead design team through innovative thin film design solutions to produce a backwards compatible inkjet printhead which enabled cost reduction and increased Fab capacity utilization. * Lead design/integration teams in the development of an optical drop detect sensor for inkjet printers and an on chip fluidic micro-recirculation system. The sensor is currently commercialized. * Developed novel test methods for the successful evaluation of low surface energy films for inkjet printheads.

Corvallis, Oregon

Responsible for sustaining the supply of fully processed semiconductor wafers from a Japanese outsource supplier. * Responsible for all sustaining activities to support supply of 5 product types with monthly volumes in excess of 10,000 wafers per month. * Responsible for implementation of QOC process at the outsource supplier. * Facilitated technical meetings on site at the supplier, and at HP. Coordinated supplier activities with HP procurement team, product engineering and HP Assembly sites. * Lead engineer for project to simultaneously transfer a semiconductor processes from HP and Japanese outsource supplier to a second outsource supplier. Required project coordination across 3 continents.

Corvallis, Oregon

Primary Metal Deposition Engineer responsible for procuring equipment, establishing processes and developing workcenter practices for a new facility startup. Integration engineer responsible for technology transfer from R&D to Manufacturing. * Developed and used a detailed interpretation of the Product Development Process to monitor the status and requirements of new process transfers from R&D to manufacturing. * Working on transfer of next generation off axis ink Thermal Inkjet process from R&D to manufacturing. This included the development of processes capable of producing beta-Ta films using single wafer processing tools. An extension of this work received Company Secret classification in 1998. * Key contributor in task force which resolved a key reliability issue, found during a cleanroom startup qualification. * Team leader for acquisition team that selected new sputter deposition equipment and procured $5M worth of new equipment. Included technical activities to develop production capable processes at the equipment supplier’s site. * Co-curator for metal deposition work-center, responsible for all technical aspects of the work-center. Trained a second metal deposition engineer and process technician.

Urbana-Champaign, Illinois

Primary Engineer responsible for failure analysis and process reliability. Safety Coordinator for Electronic Decisions Inc. * Identified source of intermetallic failures, resulting in increased robustness of devices during thermally aged reliability tests. * Implemented Step-stress testing resulting in early identification of several design and process problems. * Conducted hands-on failure analysis including, etch-back, device cross-sectioning, SEM, interaction with outside analytical services and DOE. * Organized and implemented an accelerated life test program to meet the unique requirements of Acoustic Charge Transport (ACT) semiconductor technology. * Designed and implemented company wide databases on a local area network for all product test and quality information systems. Produced various statistical and quality reports providing feedback to design and production engineers. * Implemented a failure reporting and corrective action system emphasizing preventive methods and root cause analysis. Results reported monthly to upper management.

Urbana-Champaign, Illinois

Developed and established new process capabilities several of which become standard procedures. Managed procurement and characterization of standard GaAs epitaxial materials and substrates. * Developed reliable low resistance interconnect process incorporating an ion clean to remove native oxides under high vacuum.. * Created new processes for ohmic contacts with improved morphology and acoustic attenuation. Also developed test structures for the evaluation of the processes. * Successfully demonstrated a novel laser ablation method for removal of aluminum electrodes without degrading underlying substrate. * Established a company-wide safety training program and emergency response team, receiving company achievement award in 1987. * Installed a multiple source sputtering system, and developed the second level metal process, which remained the standard metal 2 process for 10 years.

Master Of Science (M.S.), Materials Science

Bachelor Of Music (B. Mus) ; Master Of Arts (M.A.), Music

Teaching Certificate, Mathematics / Music / Education