Bruce Hughes Email and Phone Number

• Lead Flexible Hybrid Electronics Engineer for the U.S. ARMY CCDC Aviation and Missile Center• Electronics SME for the Program Executive Office (PEO) for Missiles and Space in support of the following programs regarding electronic parts and processes: Hellfire, Hellfire Launcher, Joint-Air-to Ground Missile (JAGM), Hydra rockets and other programs as required• Sit on the Joint Defense Manufacturing Technology Panel (JDMTP) Electronics Subpanel• Sit on the Nextflex Technical Council representing U.S. Army CCDC Aviation and Missile Center• Technical Fellow within Nextflex• Serve as Lead for the Government Technical Working Group (TWG) for the Device Integration and Packaging TWG within Nextflex; the Flexible Hybrid Electronics National Manufacturing Institute located in San Jose, CA• Chair “Qualification and Performance Specification for Printed Boards Containing Embedded Passive and/or Active Components” within IPC• Chair within the Joint Electronic Devices Engineering Council (JEDEC) for the Joint Council JC 13 task group on 3D Stacked Die Technology • United States patent holder: Patent number US 9,902,547B2 “Non-Planar Printed Circuit Board with Embedded Electronic Components” and Patent number US 9,788,436 “Method of Making a Circuit Board on a Mandrel”• Additional patents currently in process include; “Flexible Hybrid Electronics Direction Indicating Laser Sensor”, patent pending• Actively developing novel FHE applications for Missile and Aviation platforms at CCDC• Received an Achievement Medal for Civilian Service, Dec 2015 from the Department of the Army for my contributions to the electronics industry• Currently possess a Secret Security Clearance• Lead various Integrated Product Teams (IPT) with cross functional engineering members involving Electronic Parts Management and Failure Analysis (FA)

• Served as the technical lead for a team of manufacturing and process engineers involved in the design, development and assembly of digital telecommunications products• Provided technical direction and coordination of matrixed employees, as well as contractors, involved in the manufacturing and production of complex telecommunications electro-mechanical assemblies• Led cross functional Integrated Product Introduction (IPT) Teams • Led Design for Manufacturability (DFM) efforts on new product introductions• Chaired Operations Product Introduction Team (OPIT) meetings which managed the development and introduction of new product designs from conception through full rate production both domestically and internationally• Led multi-functional engineering teams in technology and process studies in an effort to improve product functionality, quality and reduce the overall cost of operations• Routinely published and presented technical papers at conferences and internally that addressed advanced manufacturing technologies such as embedded micro via technology, leadless chip carrier packages and specialized Printed Circuit Boards (PCBs)• Led pioneering efforts in determining the feasibility of using mixed alloy solder regarding Ball Grid Array (BGA) packages• Led implementation of two low volume mixed technology Flex Assembleon SMT lines capable of producing pre-production prototype assemblies as well as full production quantities• Led efforts addressing the Regulation of Hazardous Substances (RoHS) requirements such as developing and evaluating existing manufacturing processes and their compatibility • Conducted numerous electronics Failure Analysis (FA) efforts utilizing in-house and third party laboratory resources capable of performing advances analytical services such as SEM, XRF, XPS and similar advanced laboratory techniques

• Worked as a Senior Manufacturing Engineer with responsibility for New Product Introduction• Developed manufacturing and assembly processes for multiple high volume Surface Mount Technology (SMT) products for customers such as Sun Microsystems, Dell Computer, Nokia, and Pitney Bowes• Was responsible for all facilities layout and production line configurations• Managed Engineering Change Order (ECO) Implementation