Christopher Raybold Email & Phone Number

Galway, IE

Developed High Speed Cabled Backplanes and Midplanes for the high speed server industry.

Galway, IE

• Created Pro/E programs to decrease the time it took to get a proposed connector configuration from weeks to minutes.
• Created samples for HP proposals to support the resident engineers using connectors, SLAs, sheet metal and PCBs.
• Evaluate customer specifications to recommend solutions and ensure that we are compliant.
• Provide test data and specifications to the customer as needed.
• Earned a patent (Patent 8449321) for the design of a power connector that was eventually chosen by HP. This power connector is used on every server board HP makes and generated about $4 million in sales per year.
• Earned a patent (Patent 9022666) for the design of an Electro/Optical connectors to be used in a fiber optic backplane application.

Galway, IE

• Evaluated and quoted cable assemblies for automotive, medical, industrial and high speed RF customers for projects valued up to $13 million per year.
• Averaged 8 days to complete quotes (department average 11) and 2 days to release new products (department average 3.5 days).
• Averaged between 9 and 10 assemblies quoted/processed every week that included design and manufacturability evaluations, component specifications, costs and availability, and customer qualification builds.

• Designed 2 injection molded plugs for vent holes that were easier to use and increased customer satisfaction. Approximately 24,000 sold in the first year.
• Completely redesigned the semi trailers using extrusions and castings to improve product cost, reliability and weight. This also increased sales from 44 trailers to about 180 trailers per year.
• Worked with management to provide technical support to enable the production of the semi trailers in a new plant in Iowa.
• Successfully trained another engineer to use Pro-E program.

Racine, WI, US

• Transitioned the tooling for several product lines to Guaymas, Mexico plant.
• Developed process and tooling for various projects for companies like Dell Computer, Compaq and Lucent with values ranging from $500,000 to $4 million.
• Designed extrusions and stampings for aluminum components.
• Implemented cost improvement projects that enhanced the capabilities of a variety of metal joining applications.

United States, Connecticut, US

• Worked on the Ball Grid Array (BGA) connector and held responsibility for yield and quality of solder ball attach and re-flow processes.
• Enacted process improvements that increased first pass yield efficiency that saved company $259,300 in one year.
• Increased production from 12,000 to 15,000 pieces per shift, which cut machine availability/utilization costs and increased capacity by 25%.
• Implemented change in solder paste materials that eliminated problem of solder wicking. Result was greater product reliability and yield, increased customer confidence and decreased product recalls. his also.
• Worked with Product Development Section to implement process to change from tin-lead solder to lead-free solder materials.

United States, Connecticut, US

• Coordinated efforts of engineers and product managers from divisions in France, Netherlands, Sweden, Canada and Japan to standardize design of FCI Metral header after merger of FCI and Berg. After integration, the.
• Coordinated efforts with Manufacturing, Testing Lab and Sales to resolve customer concerns.
• Created 3-dimensional models in Pro-E for all housings in Metral header product line (90 different module variations could be used in any combination from 1-13 modules long).
• Produced customer-specific product extensions.
• Worked with other departments to condition injection mold dies and progressive stamping dies.

United States, Connecticut, US

• Guided customers through technical aspects in selection of appropriate connectors.
• Fulfilled 50-75 sample orders, requests for specifications and sales drawings daily.