Daniel Richter Email & Phone Number

North Carolina, United States

Manage development engineering team-Innovate and implement new packaging technology (wire bond, die attach, mold compounds) for product qualifications-Design optimization of both new die and new packages-Drive front-end / back-end collaboration and joint develop projects-Improve product robustness with die and package DOE's, reliability testing and failure analysis-Competitive analysis

Development engineer for discrete power devices

Managed advanced wafer level packaging and flip chip assembly projects from conception to completionLead design engineer in charge of mask layout and design.

Research Triangle Park

Worked on a small team in the ‘Advanced Product and Technology Integration’ department. Responsibilities include:• Design/Layout: Lead designer for our site. I used software such as L-Edit, AutoCAD, KLayout and Excel to design wafer-level packages, reliability test structures, novel packaging ideas and 3-D printable fixtures.• Process Development: Contributed to all phases of the development cycle, from conceptualizing and evaluating new ideas, designing and ordering photomasks, cleanroom processing, reliability testing, failure analysis and writing/presenting final reports.• Failure Analysis: Used mechanical polishing and ion-milling for precise cross-sectioning of parts. In charge of SEM/EDX operation to investigate and identify process or materials failures. • Documentation and Communication: Wrote and presented research updates during weekly team meetings. Presented reports to upper-level management.

Ncsu-Centennial Campus

Undergraduate Research• Used high performance computing to simulate molecular interactions of gold nanoparticles in solution• Analyzed large data sets using software such as JMP and Excel

Master'S Degree, Nanoengineering

Concentration in Nanoelectronics and Nanophotonics

Bachelor'S Degree, Material Science And Engineering, 3.4 Gpa