Fully involved, in setting up soft and hard gold line; converting all copper plating baths from DC to Pulse; created multi wave pulse recipes for all types of plating; fully involved in setting up automatic hole fill machine and the creation of all recipes for all types of hole fill material and aspect ratios; supervised 20 plus employees all three shifts and over see all outter layer processes (debur, plasma, shadow DM, photo image, develop, plating, SES, AOI, soft and hard gold plating, hole fill, wasted treatment, outter layer inspection).Updated process procedures, monitor process performance and behavior by collecting data from routine test vehicles,..keep track of chemical use and inventory.