Ed Armstrong Email & Phone Number

United States

United States

Remote

Navy contract

City Of Industry

Corona, California

San Juan Capistrano, Ca

Consultant with LEDEngin in software, quality, and supply chain areas. In addition, my consulting practice has broadened to these other clients:Repaired and maintained 6 “Mission Critical” Microsoft Access databases linked to over 90 tables in SQL server tables in the Finance organization of an international Consumer product manufacturing company• Microsoft Access / VBA Consultant – Developed a Training Tracking database for a large Pharmaceutical manufacturing company.• Microsoft Access /VBA Consultant – Developed a SAGE 300 SQL linked Invoicing system for a military subcontractor• Microsoft Access Consultant – Developed a Project / Budget Tracking Database for a construction company

San Jose, Ca

Responsible for assembly, test, logistics, quality, production engineering, and shipping departments. Ramped the production line from 40,000 die per month in January 2011 to 300,000 die per month in December 2011 and added Asia capacity to allow an additional 2,400,000 die per month in 2012. Ramp is continuing. Increased physical capacity by 50% in June, 2011. Die cost reduced by over 60%. Solved a difficult set of complex yield issues involving White color targeting.

RF CMOS Harmonic Oscillator products. These products are low cost, but very high volume. The complexity of the product is in the RF shielding structure and packaging that is done post-wafer fab, but in a Wafer-level process

Vice-President Operations – 1024 core 65nm multimedia chip for HDTV. Company succeeded in building the product, but it needed another revision and downturn cut short the funding of the company. Company closed in Jan 2009. Solved a “leakage” problem through FIB and X-Ray studies of active devices, convinced the foundry (Chartered Semiconductor) to make a change that fixed the problem with only a single mask change

Custom MEMs wafer fab set up with TSMC and private assembly operation with ASE in Kaohsiung. Improved yield of a 22mm x 22mm die using methodical defect reduction strategy involving possible defects from multi-foundry flow. Managed vendor relations with a mult-fab flow. BOD decided in Feb. 2006 to search for a large strategic partner to acquire the company. Company was sold to TI in July.

Converted test to a lower cost, more effective platform.Selected test, assembly, and fab partners and established relationships.Grew shipments from $600K to $9M Improved Contribution Margins from 28% to 70%Improved Gross Margins from (40%) to 50%Improved Original Schedule Date (OSD) hit rate from 38% in 2000 to >95% for all of 2004.Managed a successful fab transition from 6" to 8" wafers in another fab including moving and re-qualifying 28 die. Solved several process / device issues.

Established vendor selection criteria and selected ASIC vendor including special cells, packages, speed, and "works first time" capability for 0.4u and 0.35u digital chips. Managed vendor relationship, negotiations, and engineering support by vendor. 4 chips were completed, all worked to spec. Developed 0.8u Double Gate CMOS process capable of 20V operation Played all the roles necessary in a start-up environment: Device engineer, process engineer, purchasing, operations planning, financial analyst, business plan development, human resources, product engineer, layout designer, ... Negotiated wafer foundry agreement resulting in a 51% cost reduction.

• Started as Vice-President & General Manager, Silicon Heads. • Created Supply agreement used in sale of Wafer Fab site. • Re-engineered assembly / test operation including headcount reduction of 800 People. Net result was a $6.9M / Quarter P&L improvement and a return to profitability.

Irvine

Founded an RF/ID company through acquisition of a customer of Hughes Semiconductor Products. Product is used in access control, laundry automation, Automatic identification, and other commercial markets. Performed multifaceted market survey, segmented major markets, selected key markets, and developed market entry strategies still in use at HID. Developed promotion mix, sales plan, PR firm, product roadmap, and tactics for entry into access control market. Grew start-up business from $3M / Year to $7M / Year (current sales are >$100M / Year)

Managed three wafer fabs, assembly, test and logistics.

125mm then 150mm wafer fab start-up. Managed process engineering, equipment development and automation, and device engineering resulting in yielding wafers from the first lots ever produced in the facility. Managed capital equipment purchases including lithography, etch, diffusion, and ion implant areas. Produced 64K and 256K EPROMS and 64K DRAMS Transferred the first Coat/Stepper/Develop module to production. Developed in-situ Poly/Nitride/Poly Etch process. Solved EPROM device parameter sensitivity problem. Transferred DRAM process to IBM. Developed the 150mm conversion plan and executed the first phase. Manager, Process / Product Engineering, FAB III Managed lithography, diffusion, ion implant, thin film, device, and product engineering

M. B. A

Business Masters with emphasis on management and M&A

M. S. E. E, Solid State Electronics

Solid State Electronics. My Thesis paper was on surface mobility in MOS devices

B. S, Physics

Physics