1)Take overall hardware quality leader responsibility: company quality system, quality planning, supplier quality, product design quality, and manage OEM for mass production quality. Also lead hardware testing and component engineering, reliability team.2)Lead team to find the problem and drive to solve the problem from design proto run to mass production, which cover: design problem, component selection and supplier problem, test problem and OEM production problem, etc. 3)Build up hardware testing and component engineering team, and optimized reliability test capability.

•Managing Mobile Phone business: account P&L and customer satisfaction, including business introduction, negotiation for contract and quotation, new product introduction and mass production operation (on time delivery, inventory turn, margin, etc), business maintenance. •Daily operating several accounts and leading several program managers/team for daily operation, including: NPI, process and test engineering, material and production planning, material purchasing, inventory control, quality control, finish goods shipment and service.

Lead technical team to develop manufacturing technology for new electronic products (Mobile phone/Base station/IC, etc), such as, soldering process and reliability in HDI PCB, DCA encapsulate/reliability, etc. Have published several papers in Motorola internal and external.•Lead failure analysis team/other cross-functional team to solve SMT/assembly/raw components problem in mobile phone/base station/IC production. Got a lot of reward from Motorola top management. •Familiar with IC assembly process and reliability test.

1)Work with customer to reach product (PCB) technical/business agreement, then generate/release technical critical requirements of each production step to internal team, and follow up/manage the production team according to the schedule/engineering requirements, finish goods delivery and service after shipment.2)Lead R& D team to develop new product and technology, as high density/multi-layer PCB, Rigid-flex multi-layer PCB, HDI PCB technology, etc. Got a lot of reward from Ministry of the electronic industry