Hum Ik Khen Email & Phone Number

Penang, Malaysia

• Developed & Improvised test program using Labview Programming• Designed automated test system & test fixture to meet production capacity as well as to improve production efficiency and quality• Performing GR&R on test systems• Involved in scrap reduction projects and reduced 30% to 5% scrap rate• Performed wirebond parameters optimization (Window Characterization, ALC & BPM) to improve wirebond quality• Involved in new shop floor system (eTrace) implementation to all production test stations.• Involved in cleanroom expansion (layout arrangement, workstation, equipment and test station setup & buyoff) • Lead of improvement projects (AOI machine development, Pick & Place machine and Automated AB Glue Mixer & Dispenser)• Maintaining overall test fixtures and equipment such as (CSAM, Vacuum Reflow Oven, Conveyor Oven, Wirebond machine, Pro1600 Oven, Baking Oven & Degas)• Developed & revised work instruction & test procedure for equipment and test stations• Daily meeting with top management to report production yield and scrap yield• Support production quality issue & customer complaint as well as meeting with customers to solve quality complaints• Managing department assets & Capex budget for projects• Coordinates with vendors and works with procurement team on improvement projects easpecially on technical requirements and budget• Involved in PFMEA, HIRARC, EASI & Process Control Plan• Provide training to operators and technicians; while lead and guide technicians and engineer at the same time• Support NPI on product transfer• Support internal & customer audit

Malaysia

· Lead of SMT Yield Improvement from 40% to 99.5%· Provide SMT Operating SOP & Operator WI· Lead of Overall Yield Improvement Projects· Involve in new product development (Overall process development, SMT machines programming – Mycronic, Solder Printer, Mounters & AOI)· Involve in process FMEA development· Perform failure analysis, process mapping, root cause analysis of production issues· Support production to meet customer demands· Involve in material salvage – Save RM13,000 of material wastage· Lead of New SMT line qualification· Involve in production flow improvement· Support internal & external audit· Provide training to technician & operators

Subang Jaya, Selangor, Malaysia

* Make sure assembly lines are works as per committed KPI * Crunching data using SQL to monitor on tools performances * Collaborate with Quality team to identify and solving problems regarding customer return product* Tooling/ Process improvement to meet customer requirements and committed KPI. * Update tooling control plan as per customer requirements* Support Production team to meet customer demands* Provide preventive maintenance plan and SOP* Support internal and external audit

Petaling Jaya, Selangor, Malaysia

* To ensure tools able to build production as per committed factory KPI (Downtime, Cycletime, Assembly Yield)* Generate zero gauge, golden & silver drives for Hofmann Sensor* To make sure measurement tool is within GRnR and correlation spec* Troubleshooting and setup AIMS/ACE robotic for pick & place machine* To maintain and troubleshoot Microtech driver* To maintain and do simple troubleshooting robotic with PLC* Supporting & coordinate on new product transfer* Coordinate & support production on material and line allocation* To improve on tool interruption and cycle time which corresponded to operators and machine* Monitor machine performance & do early error detection by SQL data (Shiftly/ Weekly auto genenerated reports & EDCSPC)* Support internal & external production line audit

Kuala Lumpur, Federal Territory Of Kuala Lumpur, Malaysia

* Maintain and cleanup the RF elements for entire network of YES4g using Teraterm Macro Script* Develop excel Macro to ease for documentation using VBA* Data compilation on the throughput and capacity to monitor the network* Troubleshooting on the network when error occurred* Supporting and coordinate on migration and link upgraded activity

Bachelor'S Degree, Electrical And Electronics Engineering, Grade B/2Nd Class Upper

High School Diploma, Telecommunications Engineering, Cgpa 68/100