Hsin I (Julius) Li Email & Phone Number

Portland, Or, Us

Stuttgart, Baden-Württemberg, Germany

Greater Pittsburgh Region

✜ Provided consultation to internal stakeholders regarding incoming semiconductorfield application issues, collaborating with vendors to update silicon and streamlinequalifications..✜ Collaborated with external semiconductor design/manufacturing partners andinternal System Architects to devise AI SoC solutions aligning with performance,quality, budget, and timeline criteria.✜ Conducted market research and interviews with current AI semiconductor providers,offering… Show more ✜ Provided consultation to internal stakeholders regarding incoming semiconductorfield application issues, collaborating with vendors to update silicon and streamlinequalifications..✜ Collaborated with external semiconductor design/manufacturing partners andinternal System Architects to devise AI SoC solutions aligning with performance,quality, budget, and timeline criteria.✜ Conducted market research and interviews with current AI semiconductor providers,offering insights to guide the development of Motional’s future-generation AI chipsolutions.✜ Evaluated hardware and software maturity through AI chip architecture comparisonand development kit testing. Show less

Boise, Idaho Area

✜ Led a team of 5 structure designers in pioneering advanced ferroelectric memory teststructure design, supporting cutting-edge projects for next-generation memory.✜ Collaborated with Integration and Cell design teams to develop advanced ferroelectricmemory test structures, incorporating innovative device concepts and materials intofeasible process plans.✜ Designed test chips and structures to evaluate the electrical and physical propertiesof new materials and novel… Show more ✜ Led a team of 5 structure designers in pioneering advanced ferroelectric memory teststructure design, supporting cutting-edge projects for next-generation memory.✜ Collaborated with Integration and Cell design teams to develop advanced ferroelectricmemory test structures, incorporating innovative device concepts and materials intofeasible process plans.✜ Designed test chips and structures to evaluate the electrical and physical propertiesof new materials and novel stacks.✜ Investigated device physics and process integration, analyzing their impact on newmaterials and novel stacks, and contributing to the debugging of inline and final testresults.✜ Addressed design requirements considering photo overlay and printing limitations,as well as process-related issues such as CMP and defectivity, to ensure module-leveltestability development and compliance with DRC/LVS standards.✜ Planned and positioned test modules for frames and test dies, conducted DFMverification of mask data, and managed tapeout handling/sign-offs. Show less

Camas, Wa

✜ Worked with global partners and customers to qualify new products and improveproduct yields.✜ Spearheaded process control and device optimization for 0.18 μm Logic andMixed-Signal products, including the creation of new tapeout processes.✜ Successfully managed the transfer of 0.18 μm 1.8/5V Mixed-Mode technology fromTSMC mother Fab to ensure seamless production.✜ Led a TCAD simulation task force dedicated to resolving Fab issues and constructingsimulation templates… Show more ✜ Worked with global partners and customers to qualify new products and improveproduct yields.✜ Spearheaded process control and device optimization for 0.18 μm Logic andMixed-Signal products, including the creation of new tapeout processes.✜ Successfully managed the transfer of 0.18 μm 1.8/5V Mixed-Mode technology fromTSMC mother Fab to ensure seamless production.✜ Led a TCAD simulation task force dedicated to resolving Fab issues and constructingsimulation templates for Flash and Mixed-Mode devices.✜ Utilized TCAD process and device simulation techniques for CMOS and Flashdevices, aiding in device design and process issue debugging, and contributed to thedevelopment of high-voltage embedded Flash processes. Show less

University Park, Pa

✜ Led recitation sessions and supervised laboratory activities for calculus-basedElectricity and Magnetism courses, as well as algebra-based Introductory Physicscourses.✜ Conducted characterization and analysis of crystal surfaces and their interactionswith adatoms as part of the Surface Science Group at Penn State.

Taiwan

✜ Led compact SPICE modeling efforts for 0.13 μm and 90 nm MOSFET and passivedevices, leveraging BSIM3 model.✜ Specialized in interconnect modeling of backend RC, contributing to the optimizationof signal transmission and routing.✜ Pioneered the development of interconnect simulation software and modelingmethodologies, establishing them as the standard tools and procedures for post 0.13μm technology releases.✜ Played a key role in TCAD development and modeling for… Show more ✜ Led compact SPICE modeling efforts for 0.13 μm and 90 nm MOSFET and passivedevices, leveraging BSIM3 model.✜ Specialized in interconnect modeling of backend RC, contributing to the optimizationof signal transmission and routing.✜ Pioneered the development of interconnect simulation software and modelingmethodologies, establishing them as the standard tools and procedures for post 0.13μm technology releases.✜ Played a key role in TCAD development and modeling for 0.18 μm embedded DRAMdevices, enhancing device performance and reliability. Show less

Hsinchu County/City, Taiwan

✜ Successfully developed cell and peripheral devices for 0.19 µm DRAM technology with TCADsimulation support.✜ Delivered interconnect modeling for 0.19 µm DRAM technology.

Hsinchu County/City, Taiwan

✜ Developed magnetic parametric testing method for hard drive disk production.✜ Responsible for Guzik characterization of magnetic film and head performance.Academia

Doctor Of Philosophy (Ph.D.), Physics

Activities and Societies: American Physical Society Dissertation: "Surface structural characterization of C60 on Ag(111) and Pb(111).

Ms, Physics

* Thesis: Magnetoresistance in strong localization regime". * On 1st Rank entrance scholarship. * Solving eigenvectors and eigenenergies.

Bs, Physics