Ken Chapman Email & Phone Number

Spokane, Washington Area

Senior RF engineer for turnkey DAS and Small Cell solutions. Engineering solutions for all phases of lifecycle from Site Survey through Modeling, Design, Commissioning, Optimization, and Benchmarking. Solutions for 2G, 3G, 4G, 5G for all major carriers (AT&T, Sprint, T-Mobile, Verizon) in addition to public safety (700, 800, VHF, UHF). FCC GROL Certified. Experienced in both passive solutions and active solutions (SOLiD, ADRF, Fiplex, Comba Telecom, Zinwave, Corning, JMA Teko, MobileAccess, Andrew, Commscope, TE Connectivity). Pre-installation, Design (iBwave Design Level 3 Certified), Modeling, Commissioning, Post-Installation. Data Collection (PCTel, Anite NEMO, DataPro, Invex, JDSU Scanning, CW).

Spokane, Washington Area

Field Engineer for turnkey DAS and Small Cell solutions. Solutions for 2G, 3G, 4G for all major carriers (AT&T, Sprint, T-Mobile, Verizon) in addition to public safety (700, 800, VHF, UHF). Experienced in both passive solutions and active solutions (SOLiD, Corning MobileAccess, Andrew Commscope, TE Connectivity). Pre-installation, Design, Commissioning, Post-Installation. Data Collection (Anite NEMO, DataPro, Invex, JDSU Scanning, CW).

Owned the design of test strategy for wireless communications one-box-tester.• Collaboration with a worldwide cross-functional team (including Asia, Europe, and North America). • Owned design of test strategy and integration into manufacturing facility. • Designed and developed product-specific test processes. Worked with marketing to develop customer requirements and product datasheets. Worked with R&D to develop test processes to characterize and validate hardware performance. • Integrated test processes into production test stations. Developed new production test processes as required. Performed board redesign for RoHS compliance.• Developed new product engineering teams in Asia and Europe, which required periodic international travel. Created interview processes and training processes for new engineers. Trained team and implemented development plans for further skill development.• Owned characterization, data analysis, and process introduction of new products into a remote manufacturing facility (Asia and Europe). Provided engineering support to volume shipments. • Developed product support processes and performed product support activities at customer sites (Asia and North America).

Owned the design and development of test processes for parametric testing of RF, audio, and baseband modulation characteristics for wireless communications test equipment. Designed, developed, and characterized test station hardware and software design. Developed measurement uncertainty analysis for test processes.Developed new product characterization plans, including environmental analysis. Collaboration with a worldwide cross-functional team (including Asia and Europe).

Owned the design and development of test processes for parametric testing of RF, audio, and baseband modulation characteristics for wireless communications test equipment. Designed, developed, and characterized test station hardware and software design. Developed measurement uncertainty analysis for test processes. Developed new product characterization plans, including environmental analysis. Collaboration with a worldwide cross-functional team (including Asia and Europe).

Performed statistical process control for fab processes. Developed automated data analysis routines for use in statistical process control for fab defect data. Performed troubleshooting of wafer defects in a fab environment.

Bsee, Electrical Engineering

Activities and Societies: Tau Beta Pi Engineering Honor SocietySumma cum laude

Mba, Business Administration