Hands-on inspection, confirmation, and analysis of customer returns. Optical/IR inspection, SEM, SAM, curve tracing, layout inspection, fractography, and chemical/laser/plasma decapsulation.Generated reports and direct feedback of results to internal and external customers. Explained methodology, reasoning, techniques, and conclusions to end-users with varying levels of technical expertise. Gave presentations on semiconductor manufacturing to external and internal… Show more Hands-on inspection, confirmation, and analysis of customer returns. Optical/IR inspection, SEM, SAM, curve tracing, layout inspection, fractography, and chemical/laser/plasma decapsulation.Generated reports and direct feedback of results to internal and external customers. Explained methodology, reasoning, techniques, and conclusions to end-users with varying levels of technical expertise. Gave presentations on semiconductor manufacturing to external and internal customers.Directly responsible for the wet-lab environment, including: all facilities matters, chemical selection, approval, safety, and waste related activities. Show less

Support for 7nm and 14nm development programs with KERF failure analysis. Root-cause defect identification by hands-on laboratory techniques (test verification, electrical characterization, optical localization, sample delayering, SEM inspection, FIB sectioning). Reported and presented analysis results to the relevant process communities for yield improvement and development goals. Work with a close-knit cadre of engineers and technicians to collaboratively develop methods and procedures for… Show more Support for 7nm and 14nm development programs with KERF failure analysis. Root-cause defect identification by hands-on laboratory techniques (test verification, electrical characterization, optical localization, sample delayering, SEM inspection, FIB sectioning). Reported and presented analysis results to the relevant process communities for yield improvement and development goals. Work with a close-knit cadre of engineers and technicians to collaboratively develop methods and procedures for defect identification on leading edge semiconductor devices. Show less

Lead FA engineer working with a team of technicians to support the IBM 14nm FEOL/MOL product development. Responsible for driving and guiding the FA activities for root cause analysis (Fault Isolation, de-processing, nanoprobing, cross sectioning, and high resolution elemental TEM imaging).Preformed hands-on analysis in the lab including layer-by-layer planar de-processing of semiconductor chips using wet etch, dry etch, and finger polishing. Bench micro probing for fault… Show more Lead FA engineer working with a team of technicians to support the IBM 14nm FEOL/MOL product development. Responsible for driving and guiding the FA activities for root cause analysis (Fault Isolation, de-processing, nanoprobing, cross sectioning, and high resolution elemental TEM imaging).Preformed hands-on analysis in the lab including layer-by-layer planar de-processing of semiconductor chips using wet etch, dry etch, and finger polishing. Bench micro probing for fault confirmation, characterization, and isolation using Agilent, Keysight, and Keithly parametric analyzers. Fault Isolation Techniques such as OBIRCh, PEM, and voltage contrast.Acted as defect and yield pareto owner, presented and explained key yield detractors in weekly process integration and characterization meetings to drive yield improvement and determine necessary follow-up. Developed new failure analysis methods and techniques, trained/mentored engineers and technicians. Show less

Support for KERF failure analysis on 14nn SOI FEOL2/MOL. Responsibilities included: electrical characterization, localization, isolation, deprocessing, analysis, and reporting of results. Analysis techniques routinely include: electrical interpretation, OBIRCH, photon emission, FIB voltage contrast/macro engineering, and cross sectioning (cleave, polished, FIB, and STEM). The position requires continual contact with the characterization group to prioritize work along with the presentation of… Show more Support for KERF failure analysis on 14nn SOI FEOL2/MOL. Responsibilities included: electrical characterization, localization, isolation, deprocessing, analysis, and reporting of results. Analysis techniques routinely include: electrical interpretation, OBIRCH, photon emission, FIB voltage contrast/macro engineering, and cross sectioning (cleave, polished, FIB, and STEM). The position requires continual contact with the characterization group to prioritize work along with the presentation of results to the appropriate engineering groups. Prior to the 14nm node, I supported the 65nm, 45nm, 32nm, and 22nm technology nodes in the same capacity. Show less

As a contractor prepared, cleaved, mechanical-polished, and micro-graphed samples for Scanning Electron Microscope (SEM) analysis. Worked on all technologies (DRAM and logic) in the Physical Failure Analysis Labs of IBM’s 200mm ASTC and 300mm FAB. Cleaved bulk arrays, specific macros, and discrete devices. Hand-polished thru large arrays, discrete devices, single cell defects, isolated vias, FIB marked junctions, etc. Used plasma highlight, wet etch decoration, and deposition tools for sample… Show more As a contractor prepared, cleaved, mechanical-polished, and micro-graphed samples for Scanning Electron Microscope (SEM) analysis. Worked on all technologies (DRAM and logic) in the Physical Failure Analysis Labs of IBM’s 200mm ASTC and 300mm FAB. Cleaved bulk arrays, specific macros, and discrete devices. Hand-polished thru large arrays, discrete devices, single cell defects, isolated vias, FIB marked junctions, etc. Used plasma highlight, wet etch decoration, and deposition tools for sample preparation (ex. Chrome, TEOS, Quartz, DE100, etc.). SEMs included the Hitachi 800, 4100,4500, 4700, 5000, 5000H, and 5200. Show less

Worked with the Process Change Review Board (PCRB) and Integration/ Process Engineering. Defect analysis, data retrieval, SPC charting, wafer inspection with JEOL SEM and Leica workstations, sorting and scrapping, conducting experiments in the FAB for yield improvement, etc