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Lloyd Smith is listed as Failure Analysis Engineer at Infineon Technologies at Infineon Technologies, a company with 19449 employees, based in Livonia, Michigan, United States. AeroLeads shows a work email signal at globalfoundries.com and a matched LinkedIn profile for Lloyd Smith.
Lloyd Smith previously worked as Sr Failure Analysis Engineer at Infineon Technologies and Failure Analysis Engineer at Globalfoundries. Lloyd Smith holds Bachelor'S Degree from Western Connecticut State University.
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AeroLeads found 1 current-domain work email signal for Lloyd Smith. Compare company email patterns before reaching out.
Failure Analysis Engineer - Advanced Technology Development - Globalfoundries / IBM Microelectronics► Guided, directed, and instructed fellow engineers and technicians on instrument use, localization strategies, and results interpretation.► Provided concise reporting and rapid feedback to the appropriate engineering and development communities.► Experience with Optical Microscopy, Electron Microscopy, Focus Ion Beam (single and dual beam), sample preparation, sample decoration, and inverted TEM lamella creation.► Hands-on isolation of defects using electrical, physical, and optical isolation techniques including bench testing, OBIRCh, and in-situ SEM probe systems.Email: lloyd.smith.1119@gmail.com
Listed skills include Failure Analysis, Semiconductor Failure Analysis, Scanning Electron Microscopy, Semiconductors, and 8 others.
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A career timeline built from the work history available for this profile.
Livonia, Michigan, United States
Hands-on inspection, confirmation, and analysis of customer returns. Optical/IR inspection, SEM, SAM, curve tracing, layout inspection, fractography, and chemical/laser/plasma decapsulation.Generated reports and direct feedback of results to internal and external customers. Explained methodology, reasoning, techniques, and conclusions to end-users with.
Support for 7nm and 14nm development programs with KERF failure analysis. Root-cause defect identification by hands-on laboratory techniques (test verification, electrical characterization, optical localization, sample delayering, SEM inspection, FIB sectioning). Reported and presented analysis results to the relevant process communities for yield.
Hopewell Junction, NY
Lead FA engineer working with a team of technicians to support the IBM 14nm FEOL/MOL product development. Responsible for driving and guiding the FA activities for root cause analysis (Fault Isolation, de-processing, nanoprobing, cross sectioning, and high resolution elemental TEM imaging).Preformed hands-on analysis in the lab including layer-by-layer.
Hopewell Junction, NY
Support for KERF failure analysis on 14nn SOI FEOL2/MOL. Responsibilities included: electrical characterization, localization, isolation, deprocessing, analysis, and reporting of results. Analysis techniques routinely include: electrical interpretation, OBIRCH, photon emission, FIB voltage contrast/macro engineering, and cross sectioning (cleave, polished.
Hopewell Junction, NY
As a contractor prepared, cleaved, mechanical-polished, and micro-graphed samples for Scanning Electron Microscope (SEM) analysis. Worked on all technologies (DRAM and logic) in the Physical Failure Analysis Labs of IBM’s 200mm ASTC and 300mm FAB. Cleaved bulk arrays, specific macros, and discrete devices. Hand-polished thru large arrays, discrete devices.
Manassas, VA
Worked with the Process Change Review Board (PCRB) and Integration/ Process Engineering. Defect analysis, data retrieval, SPC charting, wafer inspection with JEOL SEM and Leica workstations, sorting and scrapping, conducting experiments in the FAB for yield improvement, etc
Other employees you can reach at infineon.com. View company contacts for 19449 employees →
Igor Ullmann
Colleague at Infineon TechnologiesAustria, Austria
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Guangzhao Z.
Colleague at Infineon TechnologiesMunich, Bavaria, Germany, Germany
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Nanthini Arjuna
Colleague at Infineon TechnologiesBayan Lepas, Penang, Malaysia, Malaysia
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Mohdshahriman Omar
Colleague at Infineon TechnologiesKuala Ketil, Kedah, Malaysia, Malaysia
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Shaquile Surya
Colleague at Infineon TechnologiesBudapest, Budapest, Hungary, Hungary
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Hetisha Patel
Colleague at Infineon TechnologiesSan Jose, California, United States, United States
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Suguna Narayanan
Colleague at Infineon TechnologiesMelaka, Malacca, Malaysia, Malaysia
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Rathakrishnan Nagarajan
Colleague at Infineon TechnologiesNegri Sembilan, Malaysia, Malaysia
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Serdar Güler
Colleague at Infineon TechnologiesNeubiberg, Bavaria, Germany, Germany
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Taehoon Lee
Colleague at Infineon TechnologiesSeoul Incheon Metropolitan Area, Korea, Republic Of
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Quick answers generated from the profile data available on this page.
Lloyd Smith works for Infineon Technologies.
Lloyd Smith is listed as Failure Analysis Engineer at Infineon Technologies at Infineon Technologies.
AeroLeads has found 1 work email signal at @globalfoundries.com for Lloyd Smith at Infineon Technologies.
Lloyd Smith is based in Livonia, Michigan, United States while working with Infineon Technologies.
Lloyd Smith has worked for Infineon Technologies, Globalfoundries, Ibm, Parity Teltech For Ibm Microelectronics, and Dominion Semiconductor.
Lloyd Smith's colleagues at Infineon Technologies include Igor Ullmann, Guangzhao Z., Nanthini Arjuna, Mohdshahriman Omar, and Shaquile Surya.
You can use AeroLeads to view verified contact signals for Lloyd Smith at Infineon Technologies, including work email, phone, and LinkedIn data when available.
Lloyd Smith holds Bachelor'S Degree from Western Connecticut State University.
Lloyd Smith is listed with skills including Failure Analysis, Semiconductor Failure Analysis, Scanning Electron Microscopy, Semiconductors, Characterization, Semiconductor Process Technology, Research And Development, and Fib.
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