Process Development Engineer - Etch
CurrentDevelopment, evaluation, and enhancement of process formulations and methods to meet material specifications.
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@analog.com
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Les Green is listed as Process Development Engineer - Etch at Analog Devices, a with 11022 employees, based in Framingham, Massachusetts, United States. AeroLeads shows a work email signal at analog.com and a matched LinkedIn profile for Les Green.
Les Green previously worked as Staff Process Engineer at Intel Corporation and Senior Process Engineer (Dry Etch) at Intel. Les Green holds Bs, Chemical Engineering, (Cum Laude); Electronic Arts Minor from Rensselaer Polytechnic Institute.
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Talented semiconductor process engineer with experience ranging from process development to scale-up and high volume manufacturing (HVM). Successful at working individually or with internal and external customers and teams.
Listed skills include Design Of Experiments, Thin Films, Failure Analysis, Spc, and 19 others.
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Development, evaluation, and enhancement of process formulations and methods to meet material specifications.
Hudson, Ma
• Support all dry etch factory sustaining and technology development needs.• Process integration support for MEMs fuel cell foundry product.
Hudson, Ma
2010 - 2014: Dry Etch Development • Process development to support new business initiatives.2009 - 2015: Intel College of Engineering Instructor• Developed 12-hour internal CSP302 Dry Etch course with annual offerings; offered through University of Arizona summer 2014.2006 - 2010: Dry Etch Sustaining• Process and equipment owner of FE and BE etch process layers on MERIE and ECR dry etch systems.
Dry Etch course instructor (CSSPII)
Hudson, Ma / Santa Clara, Ca
2004 - 2005: PECVD Thin Film Development• Antireflective Layer (ARL) Process Development to enable 65nm flash memory process.2000 - 2004: Thin Film Sustaining• Process and equipment owner for W CVD and dielectric PECVD layers. • Process and equipment qualification of new CVD and etch tools for plant start-up and ramp
Cycoloy(R) Technology Group, Selkirk, NY• Scaled-up and qualified extrusion process for flame-retardant (FR) Cycoloy(R) product line at new compounding facility in Bay St. Louis (BSL), Mississippi. • Developed predictive performance models for FR Cycoloy(R) utilizing DOE experimentation techniques to create BSL capability estimates.• Developed and implemented automated web-based statistical analysis reports for Selkirk site using VBA macros.
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Christian Jiménez
Colleague at Analog DevicesValencia, Valencian Community, Spain
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Jatin Dayal
Colleague at Analog DevicesNorth Delhi, Delhi, India
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Jhun Alfaro
Colleague at Analog DevicesCalabarzon, Philippines
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Shiela Cabigon
Colleague at Analog DevicesCalabarzon, Philippines
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Steven Tian
Colleague at Analog DevicesShenzhen, Guangdong, China
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Herson Nabor
Colleague at Analog DevicesCalabarzon, Philippines
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Mairen Eimy Lois Hernandez
Colleague at Analog DevicesPhilippines
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Nazir Shaari
Colleague at Analog DevicesPenang, Malaysia
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April Dionela
Colleague at Analog DevicesMetro Manila, National Capital Region, Philippines
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Mary Cris Galvez
Colleague at Analog DevicesCalabarzon, Philippines
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Quick answers generated from the profile data available on this page.
Les Green works for Analog Devices.
Les Green is listed as Process Development Engineer - Etch at Analog Devices.
AeroLeads has found 1 work email signal at @analog.com for Les Green at Analog Devices.
Les Green is based in Framingham, Massachusetts, United States while working with Analog Devices.
Les Green has worked for Analog Devices, Intel Corporation, Intel, The University Of Arizona, and Ge Plastics.
Les Green's colleagues at Analog Devices include Christian Jiménez, Jatin Dayal, Jhun Alfaro, Shiela Cabigon, and Steven Tian.
You can use AeroLeads to view verified contact signals for Les Green at Analog Devices, including work email, phone, and LinkedIn data when available.
Les Green holds Bs, Chemical Engineering, (Cum Laude); Electronic Arts Minor from Rensselaer Polytechnic Institute.
Les Green is listed with skills including Design Of Experiments, Thin Films, Failure Analysis, Spc, Semiconductors, Jmp, Process Engineering, and Lean Manufacturing.
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