Mark Benson Email & Phone Number

Austin, Texas Area

• Utilized strong project management expertise to deliver a portfolio of new automotive processors.
• Introduced NXP to critical chain project management, leading project launches for some of the most important and most challenging projects in the organization.
• Trained 20-member PMO in critical chain project management.
• Earned Critical Chain Project Management Professional and Expert certifications.
• Serving as internal consultant, assisting sister NXP business line to launch critical chain.

Austin, Texas

• Senior Manager, Business Agility TeamLeverage lean, six sigma and product management expertise leading cross-functional teams to make impactful and lasting changes to AMD’s engineering processes.
• Simplified and error-proofed the implementation of programmable fuses for AMD’s products.
• Introduced AMD to critical chain project management (CCPM) and helped lead first projects using critical chain.
• Led annual strategy development and deployment for multiple teams the past 3 years.
• Led technical review committee for AMD’s internal Technology Showcase.Senior Member Technical Staff, Foundry OperationsManaged wafer suppliers for AMD’s new product introductions: new silicon release, engineering split.
• Delivered AMD’s first 6-core and 12-core processors on schedule.Senior Manager, Program Management OfficeCo-led the AMD-wide cross-functional team that developed and launched 3 product families.

Austin, Texas

• Led the design phase of mixed-signal SoC projects from business case development through tape-out and silicon validation.
• Achieved first silicon success on company’s first 90nm mixed-signal IC.
• Directed risk management for this IC, resulting in effective risk mitigation plans.

Austin, Texas

• Provided operations leadership for company’s first IC product.
• Directed supplier selection, assembly development, test development, silicon de-bug, silicon repair and characterization, and successfully qualified company’s first IC.
• Improved IC yield 25 points by characterizing major failure mode, mapping failures back to the physical design and working directly with TSMC to isolate and correct root cause.
• Created company’s die size and product cost estimator which proved to be 98% accurate.Awards & Honors:
• Awarded U.S. Patent 7,136,655: “Method and Apparatus for Coverage and Throughput Enhancement in a Wireless Communication System” (2006)
• Awarded Bandspeed’s “Above & Beyond” Award – 3 times

Austin, Texas

• Built and managed a product team to enable turn-key solutions for semiconductor process development and qualification.
• Architected and executed a recruiting plan that delivered 25% growth in the company’s engineering staff in only 4 months, enlisting high-caliber engineers and a Vice-President.Awards & Honors:
• Awarded TestChip’s Achievement Award

Austin, Texas

• Technical Program ManagerLed a team of PhD-level technologists developing embedded flash for automotive customers.
• Rescued a troubled embedded flash processor and successfully delivered qualification.
• Implemented “core team” approach for technology development, becoming the benchmark and high water mark for how Motorola development teams would work in the future.Automotive Operations ManagerResponsible for design.
• Increased annual Ford sales >300% ($15M to $50M) while keeping them “very satisfied.”
• Executed numerous successful technology transfers to exacting automotive standards.FSRAM Product ManagerGlobal responsibility for 5 FSRAM product lines from development through end of life.
• Increased annual sales >200% ($7M to $16M) for FSRAM products globally.

Bachelor Of Science, Electrical Engineering

Activities and Societies: • Member Eta Kappa Nu Honor Society • Member Tau Beta Pi Honor Society • Technical Publications: 2

Master Of Science, Electrical Engineering