Principal Engineer architecting and detail designing innovative rack level liquid cooling solutions for a sustainable world

· Responsible for the development of innovative electro-mechanical design solutions for PowerEdge products, including Racks, Blades, and Towers form factors with Intel and AMD architectures and devices· Led teams of 10+ engineers between Taiwan and the US in architecting, designing, and validating concept designs for next generation products· Partnered with Dell teams, contract design resources and contract manufacturers locally and throughout the world (mainly Taiwan, Singapore, China, and India)· Creation and documentation of electromechanical design requirements, from feasibility study to critical design detail to deliver highly complex ecosystems· Primary role as hub of communication and negotiation of feature selection and critical design details with appropriate stakeholders· Ensured designs meets Dell engineering and production requirements· Developed system, board, and component level

*Responsible for the development of innovative electro-mechanical design solutions for All-In-One, Desktop and Notebook products with Intel and AMD architectures and devices*Drove strategy for product segmentation at the portfolio level to maximize leverage across Dell globally *Partnered with Dell teams, contract design resources and contract manufacturers locally and throughout the world (mainly Taiwan, Singapore, China, and India)*Creation and documentation of electromechanical design requirements, from feasibility study to critical design detail to deliver highly complex ecosystems*Primary role as hub of communication and negotiation of feature selection and critical design details with appropriate stakeholders*Development, implementation and integration of mechanical design solutions across technical disciplines from concept to production, per the development schedule and optimized to meet all design requirements*Managed ODM related tasks such as system mechanical design, thermal design, industrial design with accompanying recurring travel to Taiwan. *Ensured designs meets Dell engineering and production requirements*Developed system, board (PCB/PCBA), and component level models. *Provided mechanical design support to PCB layout and perform 3D modeling verification.*Architected and provided mechanical design support for system cooling, including heat sink, air mover, gap material, etc.*Created budget estimations for part cost, tooling, resources, and product development schedule for assigned efforts*Integral in implementing cost prediction tool (DFM Costing) across multiple groups at Dell including coordinating and executing training activities.*Optimization of engineering processes including database design (front end and back end) to support collaboration between groups within Dell, part numbering implementation for Dell team as well as at the ODMs.

Designed fully turnkey products - from concept to electromechanical production design that can be manufactured in high volumes. Specialized in military rugged product design and development involving multiple engineering disciplines.Mechanical design from concept to production including block diagram generation, architecture design, 3D CAD design, material/component selection, PCB mechanical layouts, thermal/drop simulation, and manufacturing drawings.Created photorealistic renderings for proposals and company brochures.Electrical systems design including power consumption vs. battery capacity, wire gauge selection, I/O connector selection, MLB development, power calculations, peripheral flexible PCB design, and determining required pinouts per systems requirements. Partnered with RF vendor in selecting and integrating external antennae for WIFI and GPS.Project schedule creation and management for use in ROMs and BOEs.Implemented Workgroup PDM including user and group control, creation of lifecycles, project folder structure, naming conventions, revision management control, and toolbox creation.

Coordinated and executed product development process from receipt of requirements through production release.Created master project schedules for use with BOE's and EAC's within the framework of customer product specifications, internal development processes and resource constraints. Researched and analyzed data related to the customer's product specifications.Assumed responsibility for coordinating and monitoring manufacturing of all needed components and assemblies during development of prototypes.POC between technical team, PMO and customers throughout product life cycle.

Designed and sustained Ruggedized Personal Digital Assistants conforming to MIL-STD-810F. Included on-the-fly design changes with accompanying troubleshooting, testing, cost analysis, tolerance analysis, process improvements, and implementation. Secondary role (informal) as a Quality Engineer including manufacturing process analysis, nonconforming material evaluations, and troubleshooting of various components, mechanical and electrical. Performed Thermal and Structural Analysis and provided efficient cooling solutions. Provided proper shielding solutions for EMI sensitive assemblies.Designed reliable products or systems such as electronic enclosures, chassis, mounting bases, cable assemblies, wiring harnesses compliant with the specific requirements to withstand vibration, ballistic and thermal shock. Uses compatible materials and finishes in order to guarantee corrosion protection. Provided mechanical layouts for PWB and CCA designers. Evaluates field installations and recommends design modifications to eliminate system malfunctions and increase product reliability.Knowledge of materials galvanic compatibility.Planned and directed activities in the fabrication of prototypes. Participated in the processes of assembly, integration and testing.Designed test fixtures.Ability to create and revise drawings to the latest industry standard drafting standards for components and assemblies.Working knowledge of electrical theory and industry standard fabrication processes for such components such as printed wiring boards and circuit card assemblies. Systematic troubleshooting to assess root causes and corrective actions.

Rugged electronics packaging for aerospace applications. Acquired Unit Lead position which entailed scheduling, contracts, exposure to cost management across the program, staffing requirements vs. budget restrictions, delegation of tasks to Mechanical Designers, and coordinating delivery of completed Ground and Flight hardware. Lead position required daily interface with Electrical, Materials, and Manufacturing Engineering as well as vendors and machine shop personnel. Designed hardware from conceptual layout to Flight release from given requirements. Design practices include generating tolerance analyses, compiling rough thermal and structural assessments based on customer specifications prior to hand-off to analysis team, producing CAD models and their subsequent drawings, and following up with fabrication and assembly of circuit card assemblies, machined components, and their integrated assemblies.