Principle Thermal Architect – Infrastructure Architecture Team- Responsible for the thermal technology, architecture, design, and development for NVIDIA’s data center GPUs.- Focus on the technology development and productization of advanced cooling technologies, system-level cooling technologies, and optimization of thermal control/power management features. - Responsible for customer and OEM engagements from a thermal design perspective to support system level deployments.

Sr. Manager in the Silicon Design Engineering group in the Datacenter GPU and Accelerated Processing (DCGAP) Division. DCGAP Thermal Mechanical Engineering Team manager.- Responsible for the thermal and mechanical technology, architecture, design, and development for AMD's data center based GPUs. This includes the thermal and mechanical design of these products at a module, card, and system-level. - Focus on the technology development and productization of thermal architecture and features, packaging technologies, production test thermal control, system-level cooling technologies, and optimization of thermal control/power management features. - Also responsible for customer and OEM engagements from a thermal and mechanical design perspective to support component enablement.

Architect, design, and develop thermal management strategies for liquid cooling exascale high performance computing systems. - Subject Matter Expert in direct liquid cooling of blade level solutions for the exascale HPC product line.- Provide thermal management architected solutions for Cray EX (HPC), Apollo, Edgeline, Misson Critical Systems (MCS), and HPC storage product lines- Provide technical guidance to junior level engineers developing liquid cooled solutions- Develop best practices to enable liquid cooling across multiple product lines- Investigate future cooling technologies

Manager of HPC Thermal Engineering Department- Development of the fully liquid cooled Exascale High Performance Computing platform- Lead thermal engineers across different site locations- Developed process, procedures, and best practices for the department- Managed program development budgets wrt cooling solution development- Fund and equip multiple thermal development laboratories- Mentor and develop junior engineers within the department- Coordinate and convey all program status to executive and upper level managementThermal Architect within the Thermal Engineering Department- Subject Matter Expert in direct liquid cooling of blade level solutions for the Exascale HPC product line- Provide technical guidance to junior level engineers developing liquid cooled solutions- Investigate future cooling technologies

Manager of Cray's Thermal Engineering Department- Development of the fully liquid cooled Exascale High Performance Computing platform - Lead thermal engineers across different site locations- Developed process, procedures, and best practices for the department- Managed program development budgets wrt cooling solution development- Fund and equip multiple thermal development laboratories- Mentor and develop junior engineers within the department- Coordinate and convey all program status to executive and upper level managementThermal Architect within the Thermal Engineering Department- Subject Matter Expert in direct liquid cooling of blade level solutions for the Exascale HPC product line- Provide technical guidance to junior level engineers developing liquid cooled solutions- Investigate future cooling technologies

Design, Develop, and Deploy ultra-dense supercomputing systems. Provide ultra-dense server technical expertise. Mentor engineers in the best practices and procedures of thermal and product design.

Design, Develop, and Deploy ultra-dense supercomputing systems. Provide ultra-dense server technical expertise. Mentor engineers in the best practices and procedures of thermal and product design.

Design and develop water cooled solutions for x86 servers and ultra-dense servers. Provide ultra-dense server technical expertise. Mentor engineers in the best practices and procedures of thermal and product design.

Design and develop thermal management solutions for ultra-dense servers, including CFD modeling, experimental validation, and architecture of thermal control algorithms.Provide ultra-dense server technical expertise. Mentor engineers in the best practices and procedures of thermal and product design.

Designed and developed the first direct, warm water cooling system for IBM’s x86 server node. Implemented in the Leibniz-Rechenzentrum (LRZ) SuperMUC cluster and delivered 90% heat recovery to water. Top500 (June 2012) #4, highest x86, most energy efficient supercomputer in Europe. Evaluate and specify laboratory equipment and assist management with expenses and capital for department.Optimized heat sink solutions to reduce cost by 40% and maintain specifications on a blade server solution.

Designed and Developed cooling solutions for 1U, 2U, and blade server form factors.Designed airflow bench that allowed the Thermal Team to make ten times more accurate measurement of airflow and static pressure.

Instructor in the Mechanical Engineering Department of the Kate Gleason College of Engineering. I taught lecture/laboratory courses based upon topics in Thermodynamics and Fluid Mechanics.

Designed, maintained, & repaired all types of plant HVAC systems. Designed radiation protection doors for Steam Generator 8” hand holes. Performed Erosion / Corrosion Evaluation of plant piping systems.