Working mainly with:System Engineer in high volume projects 250k - 50M.System Overview of, HW, SW, Tools and Mass Production (MP).System and Product Requirements.Technical document descriptions.Patents.System/Project Leader for small technologies projects including 1-10 persons in early stage for new technologies including proof of concept.Stand in Project Leader for high volume projects.AES Q100 Automotive Grade 2.Internal Auditer ISO9001 & 14001.Achievements:2018New Technologies ProjectsSystem Engineer in the company's most promising new technology for new finger print sensor types.2017Force Touch / Sense Touch - Introduction to marketLed the technology project that developed force sensing in finger print readers.7 key persons in the team to ensure HW, SW, Algo, Tools and MP. Result: Proof of concept in a phone mock-up and patents. The technology ended up in mass production.2016-2017System Engineer in project with mass produced fingerprint sensor.FPC1023 / FPC1028 a very small fingerprint sensor that is sold in millions of units per month today 2018.2016Made the system for a Fingerprint Sensor Module Test Card that was used by R&D and module factories to measurements on the fingerprint sensor module.Investigate Robot Testing for fingerprint sensors to find a way to test Navigation on the fingerprint surface.Led a Theses at Lund University: Robot Testing for Fingerprint sensors in collaboration with LTH Robotlab.2015System Engineer in project with mass produced fingerprint sensor.FPC1140 / FPC1145 a small fingerprint sensor that is sold in millions of units over the years and is still used today 2018.2014System Engineer in first project aiming for mass production.Sensor: FPC1020Customer: Huawei2013System Engineer in technology project to introduce capacitive fingerprint readers in existing Android phones on the market as a proof of concept to convince cell phone OEM:s that the technology is ready to be used in cell phones.

Consultant for Fingerprint Cards AB - R&DDoing:- Building up a new lab in FPC:s new Office in Malmö, Sweden- System Engineering- Project Managing- HW Measurements on fingerprint sensors

Senior Project Manager, department Global System Management.Working in a global role as a Key Component Manager.It is a role that requires good communication skills in a global company. This means regular interactions with key stakeholders from different areas, projects and development sites in the company in order to coordinate and compile data for the optimal component selection, so that the company saves cost, improves quality, achieves shorter development lead-times and increased supply flexibility.A good overview of all the running projects in the company is required. The involvement is almost during the whole project time.The data is stored as a list called KCL (Key Component List) in the company's PLM (Product Life-Cycle Management) tool.I work daily in the PLM tool.My area of responsibility:* Phone Base Band ASIC* Phone Base Band RF* Memory* Local Wireless ConnectivityTo be able to coordinate all the questions and data a weekly meeting called KCL Forum is held.KCL Forum members:* Chairman of Component Forum's* Technology* Platform and Product Planning* Head of Operation (Supply)* Head of Industrialization* Phone Project Manager's* Platform Manager's* ...Decission taken by the KCL Forum can only be appealed in the EMT (Executive Management Team).

Hardware Platform DevelopingCreating the first schematic design for the first build of an hardware platform development board (PBA).Used to:* Verify the hardware platform* Kick-start the phone projects* Make Industrialization Test Software (ETS) enabling product mass production* Phone software platform bring-up* Help RF tuning: GSM (2G), UMTS (3G), LTE (4G)* Help Local Wireless Connectivity tuning: WiFi, BT, GPS, NFCPlatform based on ASIC from Qualcomm and ST-Ericsson.Working with:* Phone Base Band chip* Phone RF chip* Memory (eMMC, uSD, RAM)* HDMI* MHL* NFC* WiFi* Blue Tooth* GPS* Glonas* Wireless charging* ...Used Tool for Schematic and CAD: Mentor Graphics - Dx DesignerI was also part of the Component Forum for Memory and Local Wireless Connectivity that are global forum within the company used to:* Discuss and decide what components to use now and in the future* Handle daily issues* Decide what to talk to with the suppliers* Handle PCN (Product Change Notification) from suppliers* Try to make a global commitment of what components to useThe Component Forum members: Development Hardware, Development Software, Technology, Operation (Supply), Industrialization, Platform projects, Phone projectsI acted as a chairman when the ordinary chairman was not present.I also managed to find time to drive a project where I/we had a look on different use cases for Near Field Communication (NFC) embedded in a Cell phone:* Payment. To be able to pay with an embedded credit card: VISA card, Master Card, etc.* Entrance system. To be able to open a door.* Public transportation. To be able to pay the ticket.

I worked on a joint project between Ericsson Mobile Platforms (EMP), Sony Ericsson and ENEA.Based on EMP U500 hardware platform and R15 software release.I worked with ENEA file system JEFF and FAT to fit in to the ENEA operating system OSE (Operation System Embedded).I Started up a File System Interest Group.I worked daily in Ubuntu (Linux) Eclipse develop environment with software written in C and C++.In the projects I worked in I was part of:Requirement setupRisk analysisTime estimableImplementation

Create the Sony Ericsson Hardware schematic referens design used for the next generation of Hardware Platform.Big development boards was made to verify the components.

Developed a SID (Service Information Device) to carry SW and SW settings to the companies machines. The job included both creating a new hardware platform and new software.The job included all steps from an idea on a piece of paper to a real handheld product.Patent filed in Sweden and U.S.A.Making software in:* C for embedded environments* C++ for embedded environments* JAVA for WindowsUsed development tool:IAR Embedded WorkbenchUsed Microprocessor:TI MSP 430