Semiconductor device engineer, manager and founder/entrepreneur with broad experience in process integration and characterization from initial concept through production ramp of finished product. Experience in substrate materials, processing equipment, performance characterization, reliability testing, and yield enhancement. Exposure to a broad array of technologies, including silicon bipolar, CMOS, BiCMOS, SOS, SOI, HEMT, MEMS, and biotechnology integrated semiconductor sensors. Materials include Si, sapphire, SiC, GaN, and gallium oxide. Applications include mixed signal, RF switches, and BCD and UHV power devices. Process techniques include layer transfer/direct wafer bonding. 86 patents granted. Experience includes process integration, device development and characterization, technology development management, foundry liaison/management, and leading the transition from technology proof of concept to high-volume production. My experience is focused on new semiconductor process and device development, with a strong focus on setting systems up to scale to volume production for commercial success.