Patrick Mccormack Email & Phone Number

Los Angeles, Ca, Us

Los Angeles, Ca, Us

Long Beach, California, United States

Managed end-to-end creation and release of complete package of drawings, including detail, sub-assemblies, and top-level assembly for company’s flagship product.• Characterized required test profiles to prove feasibility, expose problems, and develop ways to mitigate issues, moving the product to launch.• Attended design reviews at the various stages of project’s lifecycle through production release and beyond to critique and offer guidance and insights, leading to robust design more easily assembled on the line.• Participated in QA audits to identify problems and work toward mitigations to reduce risk exposure to various countries’ regulatory authorities, thereby allowing the device to achieve certification worldwide.

Hands-on involvement in new design, design adaptations, and manufacturability improvements in a fast-paced environment where priorities were fluid and that required the ability to change gears quickly.• Rescued project where in-house pump design was not working out by replacing with proven, commercially available substitute without changes being obvious. A new sheet metal frame was designed to locate and attach existing and new components.• Performed general design work and testing to improve sealing for washable and autoclavable devices; designed adaptors for one company’s handpiece to work with different company’s cutting blade, resulting in synergies across product lines.• Worked in engineering lab, building, and testing design concepts and iterations, leading to outcomes which often opened other avenues for exploration.

Laguna Hills, Ca

Identified cost-effective and reliable methods to manufacture consumables and capital equipment.• Characterized various adhesive technologies to understand performance aspects of bonding silicone to different plastics to determine reliability of adhesion during use in the field, revealing alternative approach to design was warranted.• Designed add-on accessories for handpiece wire and hose management that echoed the look and feel of the equipment, resulting in solution that integrated seamlessly with existing design.• Conducted root cause analysis of problems seen on instruments returned from the field to determine what failure modes might be, enabling mitigating measures to be put in place.

Irvine, California

Worked on several projects that were experiencing functional or reliability problems. Identified issues and proposed designs that either reimagined or replaced the initial solution. Later proposals had to fit within existing device envelopes and interface with existing internal mechanisms.• Designed replacement end-of-travel and seating arrangement for error-prone transport mechanism in immunoassay testing device, providing audible and visible feedback that test cartridge was properly seated, leading to more accurate test results and better patient outcomes.• Designed alternative approach to expensive and space-constrained safety door to prevent ingress of fingers during unloading of the cartridge under test.• Redesigned component lifting mechanism to be adjustable and added more powerful motor to overcome forces experienced during operation, resulting in more reliable operation of the device in the field.• Redesigned mounting method of a device’s display screen to reduce warping and discoloration of image.

Laguna Hills, Ca

Worked on company’s next generation device, taking industrial design models through project’s alpha, beta, and pilot engineering phases to production handoff.• Designed electrode package assembly with custom wire management features ensuring ease of assembly and routing such that pinching or cutting of the wires was avoided.• Sourced acoustically transparent cloth for a critical (IP55) water and dust ingress protection application for speaker and buzzer protection when the existing vendor would no longer sell their product to the company.• Designed battery using off-the-shelf cells with locking features to prevent movement of contacts relative to mating motherboard on device side.

Bachelor Of Science (Bs) In Computer Science, Computer Science, 3.8 Summa Cum Laude

Hnc In Mechanical Engineering, Mechanical Engineering, 3.6 Gpa