Robert Schoon Email & Phone Number

Broomfield, Colorado, United States

Colorado, United States

Electronics packaging design for small (Micro- and Cubesats). Sustaining role for several in production subsystems as well as initial design and qualification support of new ones. Owned detailed design and documentation using SolidWorks (2022) and in-house configuration management systems.

Albuquerque, New Mexico

Panels product lead for Internal Research and Development. Own panels design analysis process development and refinement. Fixer / Project Manager for various internal and customer engineering projects. Charged with growing and maintaining the organizations ability to understand, analyze, propose, and design all customer spacecraft solar power needs.

Cedar Rapids, IA

A “Fixer” in a mechanical design support group servicing the entire Commercial products division. Also support Government Systems team as required. Analytical resource for complex problem solving in an extremely broad portfolio of avionics and aerospace products across the life cycle, and across commercial, business regional, and military markets. Charged.

Albuquerque, New Mexico, United States

Drove an extremely diverse portfolio of programs and projects to on time delivery within technology, budget, and schedule constraints. Customers included the national labs, entrepreneurs, startups, and large defense contractors. Technologies included commercial and aerospace electronics, renewable energy, directed energy (medical and military), control.

Engineering and Project Management bringing a new commercial, concentrated photo voltaic solar array to market. Drove test planning, execution, and documentation of IEC 62108 self-certification test effort on utility scale, concentrated photovoltaic power (CPV) generation product. Designed, analyzed, procured and implemented product tooling and processes.

After my layoff from LSI I took some time off and then took several months to find the new position at Emcore, Inc.

Led cross-functional development teams in rigorously run portfolio management environment. Successfully managed five increasingly complex, high performance disk drive subsystem (RAID) development programs ranging from $200k to $40 million budgets over six-month to three-year timelines. Majority of team members were remotely located in Bangalore, Milpitas.

Boulder, Colorado

Recruited as Lead Mechanical Engineer to drive worldwide, cross-functional development team developing leading edge, high performance fiber channel, Ultra320 SCSI, and iSCSI disk-array products. Successfully navigated creation of high performance, lower cost mechanical subsystems through technological and communication challenges. Effectively collaborated.

(Also, April 1996 - December 1997) Lead Electronics Packaging Engineer working space based telescope and remote sensing instruments including 4 Hubble Space Telescope upgrade instruments. Member of cross-functional instrument design team producing high-reliability, state-of-the-art, electronics system designs. Design and lead the design of circuit board.

Project team leader on the cost reduction / Value Engineering of robotic DLT (Digital Linear Tape) Libraries. Five-year-old startup Company with 110 employees. Product was designed with minimal tooling expenditure and shipping approximately 200 units per month. Worked to tool up parts for Injection molding, stamping, die casting etc. as tooling money.

Served as Project Engineering Team Leader, Program Manager and Lead Mechanical Engineer reporting to the Vice President of Engineerg. Developed optical library, mass storage products in a small (less than 20 engineers), remote R&D facility. Responsible for product technical content, material, tooling, and labor budgets, schedule and resource allocation.

Optical, mass-storage, peripheral product development. Performed design, documentation, test, procurement, assembly, vendor liaison, debug, and qualification in a small (again, less than 20 engineers), remote, product development facility. Designed and validated solutions for show-stopping vibration and thermal problems on an in-process, rugged 5.25 inch.

Project team leader developing high performance, digital telecommunications equipment. New product design, analysis, and documentation in a highly concurrent engineering environment. Acquired the tools and solved several show stopping thermal issues on a number of in process products. Completed the design and introduction of two new outside plant products.

Various positions in the engineering design, development, validation and manufacturing of militarized and ruggedized storage and remote sensing subsystems for all major branches of the U.S. armed forces and several foreign customers. Served as an analytical resource providing problem solving capabilities and engineering knowledge the company had not.

Design team member on the first high performance, write-once optical disk drive. Gained initial experience in sheet metal, injection molded plastic, and sand casting design. Designed, analyzed, experimentally verified, and documented a state of the art vibration isolation system for the optical head. FIrst exposure to Computer Automated Design tools..

Lab manager for PHd Solid State Materials Scientist. Performed material properties tests on developmental superconductors. Investigated stress effects on same. Supported preparation of lab apparatus, test hardware, test specimens, figures and text for peer reviewed publications on the subject. See J.W. Ekin, Strain scaling law for flux pinning in practical.

Ms, Mechanical Engineerg / Analytical Mechanics, 3.5 / 4.0 Wgpa

Activities and Societies: Tau Beta Pi inductee. MS Mechanical Engienering specializing in Analytical Mechanics. Tau Beta Pi Inductee.

Mba, Technical Management

Activities and Societies: Beta Gamma Sigma inductee. MBA specializing in Technical Project Management. Beta Gamma Sigma inductee.

Bs, Engineering Design And Economic Evaluation, 3.63 / 4.0 Wgpa

Activities and Societies: 4.0 GPA last 7 consecutive semesters. BS Engineering Design and Economic Evaluation.

Master Of Business Administration - Mba, Technical Project Management

Activities and Societies: Beta Gamma Sigma Inductee