Assist Semiconductor equipment manufacturers to install next generation tools for advanced applications and procedures.

Wrote training procedures and trained all new hire employees and vendors for working in a cleanroom environment in the semiconductor industry at the new TSMC Wafer manufacturing plant in North Phoenix.

Project Manager for 200mm and 300mm equipment install and de-install projects worldwide. Performed outgoing quality inspections on all equipment and paperwork prior to customer inspections. Set up tool removal scheduling and parts requirements. Interfaced with customers, vendors and engineers to complete project on time and with zero lost time accidents.

Quality Control Engineer and Assistant Project Manager for 300mm equipment de-install project in Dresden, Germany. Performed outgoing quality inspections on all equipment and paperwork prior to customer inspections. Interfaced with customers, vendors and engineers to complete project on time.Previously responsible for removal of 300mm semiconductor equipment. Primarily focusing on metrology and probe equipment, including Accutech UF3000 prober, Agilent 4072B tester, August Technologies scanner. Also specialized in de-installation of Lithius Cleantrak lithography tools.

Safety Engineer for the equipment installation at a new 300mm semiconductor wafer processing facility in Austin, TX. Responsible for inspection and documentaion of equipment during the installation phase. Tools are inspected prior to electrical startup, chemical or gas startup and final inspection prior to turning the tool over to production.

Responsible for refurbishing and testing semiconductor equipment. Responsible for identification, cataloging and storing new and used parts as part of a warehouse inventory team. Responsible for removal and inventory of 200mm semiconductor equipment; Responsible for installation and start-up of Novellus C-1 tool.

Responsible for de-installation of 300mm semiconductor equipment from a factory in Taiwan. Responsible for removal of various 300mm semiconductor equipment, including Applied Etchers, CVD, Metal and SEM tools.

Responsible for maintaining semiconductor equipment in a Galium Arsenide (GaAs) wafer fabrication facility. Duties included managing the installation of new equipment and removal of obsolete equipment, developing and writing PM procedures and schedules, training and developing equipment technicians and interfacing with vendors. Other duties included (but not limited to) leading several inter-discipline improvement teams. I was also selected to travel to Japan to refurbish and install equipment on site. Responsible for all process and equipment related issues in the Chemical Vapor Deposition (CVD) process area. Duties included maintaining equipment and process variations, training operators and technicians, writing work specifications and developing new processes. Also responsible for all diagnostic (metrology) equipment required to run and verify the processes. Supervised a crew of technicians to provide around the clock coverage of the CVD process area.

Responsible for all process and equipment related issues in the Chemical Vapor Deposition (CVD) process area. Duties included maintaining equipment and process variations, training operators and technicians, writing work specifications and developing new processes. Also responsible for all diagnostic (metrology) equipment required to run and verify the processes. Supervised a crew of technicians to provide round the clock coverage of the CVD process area.

Lead and trained a group of technicians to maintain process related equipment. Interfaced with vendors to reduce cost of ownership. Worked with engineers to run and evaluate experiments to improve processes and equipment availability.

Primary duties included disposition of out of spec product and process improvement through statistical and experimental analysis.