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@intel.com
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2 phones found area 503
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Rob Hensel is listed as Senior Technical Program Manager at Intel Corporation,Ethernet Products Group at Intel Corporation, a with 10 employees, based in Hillsboro, Oregon, United States. AeroLeads shows a work email signal at intel.com, phone signal with area code 503, and a matched LinkedIn profile for Rob Hensel.
Rob Hensel previously worked as Senior Technical Program Manager at Intel Corporation and Hardware Engineering Manager, Eng. Project Manager - New Technology Group, Modular Innovation Group at Intel Corporation. Rob Hensel holds Masters Of Science, Engineering/Industrial Management from Portland State University.
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AeroLeads found 1 current-domain work email signal for Rob Hensel. Compare company email patterns before reaching out.
Accomplished, innovative Design Engineering Leader with extensive experience in full lifecycle project management, product engineering and development, R&D, and manufacturing strategic planning. Recognized as a cross-functional leader with a history of success leading stakeholders (product team, marketing, manufacturing) through the product development lifecycle. A strategic visionary with a record of driving continuous improvement by standardizing the design value chain to drive predictable and repeatable outputs that reduce overall design costs and time-to-market. Improved design reviews and "shift-left" of materials engagement, validation, and manufacturing that reduced late-in-the-program surprises, improved time-to-market results.
Listed skills include Engineering Management, Semiconductors, Firmware, Debugging, and 20 others.
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A career timeline built from the work history available for this profile.
Santa Clara, California, Us
Technical Program Manager - Ethernet Products Group, Intel CorpManaged the development of Networking Devices from product concept and market analysis through engineering development and product introduction.
Santa Clara, California, Us
Lead HW product development execution of maker products, specifically the Joule Maker platform and associated peripheral boards. Managed development team and managed project execution. Delivered to accelerated schedule to deliver a market ready product for IDF 2016 (on store shelves). Leveraged talent and process to deliver a high quality product with few revisions. Team included electrical board designers, CAD, thermal and mechanical and sustaining. Key interface with QnR to execute all regulatory requirements for revenue product.
Santa Clara, California, Us
Engineering Manager - Client Computing Group (Sept 2014-Present)Drove development execution of system level computing products. Facilitated the collaboration of highly cross-functional teams in defining the product requirements, the engineering response and the resulting development schedule and engineering development. Drove the development of a strong engineering process for high quality PCB design, starting from requirements, to design and review, layout and board tapeout.Engineering Manager - Sort Test Technology Development (May 2012-Sept 2014)Directed the development of highly complex boards and instruments. Responsible for the full development and deployment lifecycle of semiconductor test instruments. Managed the board development and layout process, mechanical engineering, thermal analysis and solution and FPGA development. Responsible for development and deployment into the far east Asia factory.Engineering Manager - Test Development Engineering (2004-May 2012)Directed engineering staff, technicians and project managers in full lifecycle development of test systems/solutions for a wide variety of products with responsibility for electrical and mechanical hardware, software, test architecture, system fabrication, assembly, fabrication and deployment. Managed staffing, org budget, org development and performance management.System Architect – Test Development Engineering (2002-2004)Architect for the development of complex high-volume test systems for 10Gb optical communications products. Developed the overall architecture including mechanical systems, power systems, various interface boards, optical test architecture and software. Deployed systems across multiple manufacturing site in both the US and Asia.Lead Software Developer - Test Development Engineering (1999-2002)Drove test software dev for Bluetooth wireless product, software developer for HVM graphics test, and various other test software needs within Test Development Engineering.
Circuit and PCB DesignerCircuit designer, PCB layout, software development and prototype build and test. Skilled at Mentor Graphics PADS design suite of tools.Water System Engineering - Distribution systems, pumping stations, reservoirs and controls.
Directed development of Windows-based product configuration software and real-time embedded control software for motor drive products. Managed version control systems and product configuration, while ensuring highest levels of software quality and functionality in accordance with project specifications.- Developed embedded control code for high-performance motor drive. - Designed and implemented communications interface for motor drive product.
Designed electromagnetic circuits for disk drive motors, in addition to designing magnetizers and test equipment for high-volume manufacture of brushless DC disk drive motors. Wrote modeling and simulation software for design work, as well as for high-volume test environment. Project managed product design projects from concept to volume production.
Other employees you can reach at intel.com. View company contacts for 10 employees →
Yohann Burette
Colleague at Intel CorporationHillsboro, Oregon, United States
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JP
John Paul Cummins
Colleague at Intel CorporationIreland
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RM
Robert Mccaskey
Colleague at Intel CorporationGreater Phoenix Area, United States
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Ismail Ebrahim
Colleague at Intel CorporationBengaluru, Karnataka, India
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AW
Amir Wassermann
Colleague at Intel CorporationRamat Gan, Tel Aviv District, Israel
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Ashley Goernitz
Colleague at Intel CorporationTempe, Arizona, United States
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Ed Pizzo
Colleague at Intel CorporationGilbert, Arizona, United States
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Amirul Faeez
Colleague at Intel CorporationBayan Lepas, Penang, Malaysia
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李建华
Colleague at Intel CorporationShunyi District, Beijing, China
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Ankita Bat
Colleague at Intel CorporationMaharashtra, India
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Quick answers generated from the profile data available on this page.
Rob Hensel works for Intel Corporation.
Rob Hensel is listed as Senior Technical Program Manager at Intel Corporation,Ethernet Products Group at Intel Corporation.
AeroLeads has found 1 work email signal at @intel.com for Rob Hensel at Intel Corporation.
AeroLeads has found 2 phone signal(s) with area code 503 for Rob Hensel at Intel Corporation.
Rob Hensel is based in Hillsboro, Oregon, United States while working with Intel Corporation.
Rob Hensel has worked for Intel Corporation, Independent Consultant, Semipower Systems, and Synektron Corp..
Rob Hensel's colleagues at Intel Corporation include Yohann Burette, John Paul Cummins, Robert Mccaskey, Ismail Ebrahim, and Amir Wassermann.
You can use AeroLeads to view verified contact signals for Rob Hensel at Intel Corporation, including work email, phone, and LinkedIn data when available.
Rob Hensel holds Masters Of Science, Engineering/Industrial Management from Portland State University.
Rob Hensel is listed with skills including Engineering Management, Semiconductors, Firmware, Debugging, Pcb Design, Hardware, Embedded Systems, and Electronics.
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