Sr. Director, Headset Product Development
CurrentSame role as with Poly, however now doubly exciting times to make HP the leaders in Hybrid Work!
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@verifone.com
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Robert Netz is listed as Sr. Director, Hardware Development at HP, based in Greater Chicago Area, United States. AeroLeads shows a work email signal at verifone.com, phone signal with area code 215, 408, and a matched LinkedIn profile for Robert Netz.
Robert Netz previously worked as Sr. Director, Headset Product Development at Hp and Sr. Director, Hardware Development, Enterprise Headset BU at Poly. Robert Netz holds Bachelor Of Science, Electrical Engineering (Bsee) from University Of Illinois Urbana-Champaign.
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Passionate about creating great hand held electronic and IoT products! 10+ years experience leading cross-functional highly complex projects and programs to create and launch successful, innovative wireless technology devices. Committed to transparency with proven track record exceeding business case and quality goals while minimizing development and production costs. Responsive and flexible, with proven ability to influence others and facilitate agreement with all stakeholders such as Product Management, Product Quality, Supply Chain, Account, Industrial Design and Software Development groups. Driven executive building and inspiring global hardware (HW) and Product Design (PD) development teams through ever-changing, often ambiguous conditions to create compelling products and platforms with aggressive development schedules. Conceiving, designing, developing/optimizing prototypes, ramping production and launching innovative products at rapid pace.
Listed skills include Lte, Mobile Devices, Cross Functional Team Leadership, Product Development, and 40 others.
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A career timeline built from the work history available for this profile.
Palo Alto, Ca, Us
Same role as with Poly, however now doubly exciting times to make HP the leaders in Hybrid Work!
Santa Cruz, California, Us
Global leader of headset hardware new product development and sustaining engineering. Both internally developed products and ODM developed products. Teams in Santa Cruz CA, Tijuana MX, and Suzhou CN. Poly was purchased by Hewlett Packard in September 2022 and we officially became part of HP on November 1 2022.
New York, Ny, Us
• Built team of 15 highly experienced experts in Mechanical, Electrical Baseband, RF, Antenna, FEA Simulation, and Contactless (CTLS) engineering. Creating entirely new EE architecture and Product Design for platform product Carbon Mobile 5 handheld PCI and EMVCo compliant payment devices supporting global WAN and LAN systems.o Two completely different PDs, but with a single main PCB between the two to maximize supply chain and product development efficiency.o Bringing smartphone attributes to payment space, including very low-cost imaging solution for barcode scanning.o Leading global teams comprised of Chicago and Taiwan Verifone engineers, working in conjunction with contract Asian engineering bringing completely new and critical mPOS device to market faster than ever for Verifone.
Boston, Ma, Us
• Contract role directing low cost ODM partner development of Toast GO, a new Android tablet based product with integrated MSR and PSCR payment module, to expand Toast business into new areas. Managing supply chain for existing product and leading team of hardware product managers and program managers.
Chicago, Illinois, Us
• Directed cross-functional EE and ME team of 40, innovating Moto G4 product design platform and Moto G4+ Android smartphone, with more than 8M units shipped to date.o Moto G4 PD platform enabled efficiently creating 3 tiers of smartphone: G4, G4+, and G4 Power.o Partnering with Lenovo development team in China, key to streamlining product execution and acceleration of development cycle by 6 weeks.o Exceeding 20% GM goal, coming in under 10.2% annualized predicted Field Failure Rate (pFFR) goal, and meeting critically needed business case expectations.• Managed EE and ME teams to design Moto E2 Android smartphone with LTE, selling more than 9M units with 15%+ GM and achieving 7.8% annualized pFFR goal.o Innovating high-tier features for low-tier market, such as reliable low cost single housing design, customizable trim rings, key cost-reduced Moto actions features and using Qualcomm Snapdragon mobile station modem (MSM 8916), reaching 2nd highest-selling Motorola smartphone ever.o Created product design platform and 2 independent PCB designs for global LTE and 3G versions, enabling lowest cost quad core and RF chipsets for best GM possible with maximum engineering re-use.• Led HW development for 1st generation Moto G Android smartphone, partnering with Qualcomm, becoming very FIRST ODM to commercialize MSM 8x26 Quad Core processor completing device chipset through close co-development.o Bringing disruptive value 720p display, high tier performance, best-in-class quality and stylish Moto X design language.o Shipping 15M+ units globally at over 10% GM, achieving 8.2% pFFR goal. o Achieving highest-selling Motorola smartphone ever.
Chicago, Illinois, Us
• Directed EE and ME teams in designing Motorola RAZR i Android smartphone.o Serving as catalyst for generating $50M worth in marketing funds used for helping rebuild Motorola brand awareness in Europe while accruing $80 per unit in GM.o Becoming Motorola’s very first smartphone to feature complete Intel chipset while simultaneously functioning as evolution of Droid RAZR ID.• Led HW product development of Motorola Droid Bionic LTE Android smartphone.o Integrating Qualcomm CDMA chipset, Motorola Wrigley Chipset, and Texas Instruments Open Multimedia Applications Platform (OMAP) dual core main processor in Bionic. o Motorola’s FIRST commercialized LTE device, holding 50%+ of LTE market share at Verizon, and serving as critical lead device in developing chipset platform for Droid RAZR.
Chicago, Illinois, Us
• Directed EE and ME HW development for Motorola Droid 2 Android smartphone.o Launching project on time, shipping 1M+ units, and generating GM of $110 per unit.o Achieving key cost, performance, and ID improvements over original iconic Droid.• Drove creation of Motorola’s first side slider QWERTY device, the Verizon Moto Rival A455, utilizing Qualcomm MSM 6075 single chip design and selling more than 1.5M units.• Led development of Motorola hi-tier CDMA 1X/evolution-data optimized (EV-DO) RAZR MAXX, designed as Motorola’s very first product to be based on Qualcomm MSM 6550 with GPS.o Reaching sales of almost 1M units at $100+ per unit in GM.• Managed complete design and production of EE platform with dual capability for implementation into both V410/V415 and V323/V325 products, based on MSM 61xx platform.o Achieving sales of more than 2M V32x units, generating average GM of $30+ per unit.• Spearheaded EE development efforts for Motorola Low Tier CDMA 1x V276, V265, V262, and V260.o Built cross-functional team of 15 new direct reports over 2-month span, leading inexperienced members in creating successful line of products within 9-month span. o Selling more than 10M units worldwide with average GM of more than $25 per unit.
Chicago, Illinois, Us
• Headed company’s development of HW platform for CDMA 1x, using MSM 61xx, first Motorola platform using Qualcomm CDMA2000 radioOne platform.• Managed team of 15 engineers spanning RF and baseband skills from both US and Korea. Mentoring, training and professionally developing engineers and junior managers.• Led development of v120e, Motorola’s FIRST cellphone supporting GPS E911 position location mandate.• Drove development of v816x CDMA/Analog dual mode IS95A handset platform utilizing Motorola/Freescale chipset for North American carriers building on success of GSM version.
Chicago, Illinois, Us
• Served as EE leader of V3620 clamshell device, key follow-up to iconic StarTAC II and PD platform for v3690 GSM clamshell device.• Supervised engineering team of six direct reports, driving individual daily contributions to StarTAC II clamshell-style wearable portable cell phone project.o Succeeding as cost-reduced and performance-improved follow-up to StarTAC.• Developed keen expertise in RF, mastering desense evaluation and problem solving skills on bench.• Served as key contributor on team developing revolutionary StarTAC analog portable cellphone.• Contributed to design and production of various key cell phone development projects, including DynaTAC and MicroTAC portable phones, with responsibilities in RF and antenna circuit design.• Designed, optimized, and validated receivers, transmitters, synthesizers, and antennas for ETACS analog car phone project.
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Quick answers generated from the profile data available on this page.
Robert Netz works for HP.
Robert Netz is listed as Sr. Director, Hardware Development at HP.
AeroLeads has found 2 work email signals at @verifone.com for Robert Netz at HP.
AeroLeads has found 2 phone signal(s) with area code 215, 408 for Robert Netz at HP.
Robert Netz is based in Greater Chicago Area, United States while working with HP.
Robert Netz has worked for Hp, Poly, Verifone, Toast, Inc., and Motorola Mobility, A Lenovo Company.
Robert Netz's colleagues at HP include Megan Frazier Salch, Melissa Munson John, Heidi Parker, Michael Long, and Raquel Marquez, Dmist.
You can use AeroLeads to view verified contact signals for Robert Netz at HP, including work email, phone, and LinkedIn data when available.
Robert Netz holds Bachelor Of Science, Electrical Engineering (Bsee) from University Of Illinois Urbana-Champaign.
Robert Netz is listed with skills including Lte, Mobile Devices, Cross Functional Team Leadership, Product Development, Engineering Management, Rf, Mobile Communications, and Cdma.
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