Principal Engineer Silicon Photonics Process and material development; involved in initial design efforts, provide details and capability of current equipment platform, define where new equipment & processes are required, evaluate how new materials can be incorporated into existing equipment set, develop new processes as needed, develop new materials as needed - primarily adhesives and polymers via fillers and custom blendsEvaluation of new equipment, work with existing equipment vendors on technical roadmap, engage with new equipment vendors to understand capabilities and limitations, established strong relationships with vendors and drive capabilities to meet our future needs, define equipment prove-in and buy off criteria, define introduction into manufacturing including training, documentation, SPC, troubleshoot tree, FMA techniques, service & maintenance, upgrade and modificationDesign and verification of new piece parts, strong interaction with piece part vendors, review available and potential techniques, review drawings and critical dimensions, review measurement techniques for critical parameters, review cleanliness and cleaning techniques, determine acceptance criteria, track lot to lot variations and drift, drive for improved quality and reduced cost, define material handling and storage requirements, define material testing methodology - SEM/EDAX, DSC, TGA, TMA DMA, optical profilometer, shear and pull testing, IR camera, C-SAM, surface properties, cleaning techniques (plasma, UV ozone, solvent, ultrasound), define thermal treatments prior to assembly, Responsible for new processes from development into manufacturing - optical alignment and die attach processes, ensure the process passes pre-qual, documentation and training, introduction into manufacturing up to an agreed upon ramp rate, define the acceptable variation in both piece parts and equipment that will achieve a successful product, provide support to manufacturing for any issues, maintain close interact with manufacturing, monitor large sample sizesDevelopment and modification adhesives and polymers via fillers, initiators and base resin, extensive accelerated aging (TC and DH) to determine dimensional stability, mechanical strength, out gassing, thermal conductivity, corrosion, environmental chambers and test equipment, silane adhesion promoter Regularly attend conferences and training in order anticipate new processes and materials which will be available to us in the near future, VFM, Au to Au diffusion bonding, IR imaging, new adhesives and substrates,